Product Information

NTTFS4C13NTAG

NTTFS4C13NTAG electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET Pwr MOSFET 30V 38A 9.4mOhm SGL N-CH

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8299 ea
Line Total: USD 0.83

48 - Global Stock
Ships to you between
Thu. 30 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
48 - WHS 1


Ships to you between
Thu. 30 May to Tue. 04 Jun

MOQ : 1
Multiples : 1

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NTTFS4C13NTAG
ON Semiconductor

1 : USD 0.8043
10 : USD 0.6989
30 : USD 0.6333
100 : USD 0.5403
500 : USD 0.5103
1500 : USD 0.4965

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Series
Transistor Type
Brand
Factory Pack Quantity :
Configuration
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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NTTFS4C13N MOSFET Power, Single, N-Channel, 8FL 30 V, 38 A Features Low R to Minimize Conduction Losses DS(on) NTTFS4C13N 3. This is absolute maximum rating. Parts are tested at T = 25C V = 10 V, J qs I = 15 Apk, E = 11 mJ. L AS THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 5.8 JC JunctiontoAmbient Steady State (Note 4) R 60.8 JA C/W JunctiontoAmbient Steady State (Note 5) R 160 JA JunctiontoAmbient (t 10 s) (Note 4) R 33.5 JA 4. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 5. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V V = 0 V, I = TBD A, 34 (BR)DSSt GS D(aval) V (transient) T = 25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 14.9 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V V = V , I = 250 A 1.3 2.1 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 4.8 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 7.5 9.4 DS(on) GS D m V = 4.5 V I = 12 A 11.2 14 GS D Forward Transconductance g V = 1.5 V, I = 15 A 40 S FS DS D Gate Resistance R T = 25C 1.0 G A CHARGES AND CAPACITANCES Input Capacitance C 770 ISS Output Capacitance C 443 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 127 RSS Capacitance Ratio C /C V = 0 V, V = 15 V, f = 1 MHz 0.165 RSS ISS GS DS Total Gate Charge Q 7.8 G(TOT) Threshold Gate Charge Q 1.4 G(TH) nC GatetoSource Charge Q 2.9 V = 4.5 V, V = 15 V I = 30 A GS GS DS D GatetoDrain Charge Q 3.7 GD Gate Plateau Voltage V 3.6 V GP Total Gate Charge Q V = 10 V, V = 15 V I = 30 A 15.2 nC G(TOT) GS DS D Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Pulse Test: pulse width 300 s, duty cycle 2%. 7. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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