ISM330DHCX Datasheet iNEMO inertial module with embedded Machine Learning Core: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications Features 3D accelerometer with selectable full scale: 2/4/8/16 g 3D gyroscope with extended selectable full scale: LGA-14L 125/250/500/1000/2000/4000 dps (2.5 x 3.0 x 0.83 mm) typ. Extended temperature range from -40 to +105 C Embedded compensation for high stability over temperature SPI/IC serial interface Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications) Six-channel synchronized output Sensor hub feature to efficiently collect data from additional external sensors Embedded smart FIFO up to 9 kbytes Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors Machine Learning Core Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click Embedded pedometer, step detector and counter for healthcare applications Analog supply voltage: 1.71 V to 3.6 V Embedded temperature sensor Embedded self-test both for gyroscope and accelerometer High shock survivability Product status link ECOPACK, RoHS and Green compliant ISM330DHCX Product summary Applications Order code ISM330DHCX ISM330DHCXTR Industrial IoT and connected devices Temp. range Antennas, platforms, and optical image and lens stabilization -40 to +105 C Robotics, drones and industrial automation LGA-14L Package Navigation systems and telematics (2.5 x 3.0 x 0.83 mm) Vibration monitoring and compensation Packing Tray Tape & Reel Product labels Description The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. Product resources The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows AN5398 (ISM330DHCX) the design of a dedicated circuit which is trimmed to better match the characteristics AN5392 (Machine Learning Core) of the sensing element. AN5388 (Finite State Machine) TN0018 (Design and soldering) DS13012 - Rev 7 - November 2020 www.st.com For further information contact your local STMicroelectronics sales office.ISM330DHCX In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness. The ISM330DHCX has a full-scale acceleration range of 2/4/8/16 g and a wide angular rate range of 125/250/500/1000/2000/4000 dps that enable its usage in a broad range of applications. All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization. An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package. DS13012 - Rev 7 page 2/167