TQM150NB04DCR Taiwan Semiconductor AUTOMOTIVE Dual N-Channel 40V 175C MOSFET FEATURES PRODUCT SUMMARY AEC-Q101 Rev-D Qualified PARAMETER VALUE UNIT 100% UIS and R tested g V 40 V DS 175C Operating Junction Temperature V = 10V 15 GS RoHS Compliant R (max) m DS(on) Halogen-free according to IEC 61249-2-21 V = 7V 28.6 GS Q g 18 nC APPLICATIONS Power Switch for 12V Automotive Systems Solenoid and Motor Control Automotive Transmission Control DC-DC Converters PDFN56U Dual Note: MSL 1 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V 40 V DS Gate-Source Voltage V 20 V GS T = 25C 39 C (Note 1) Continuous Drain Current I A D T = 25C 9 A Pulsed Drain Current I 156 A DM (Note 2) Single Pulse Avalanche Current I 15 A AS (Note 2) Single Pulse Avalanche Energy E 34 mJ AS T = 25C 48 C Total Power Dissipation P W D T = 125C 16 C T = 25C 2.4 A Total Power Dissipation P W D T = 125C 0.8 A Operating Junction and Storage Temperature Range T , T - 55 to +175 C J STG THERMAL RESISTANCE PARAMETER SYMBOL MAXIMUM UNIT Thermal Resistance Junction to Case R 3.1 C/W JC Thermal Resistance Junction to Ambient R 61 C/W JA Thermal Performance Note: R is the sum of the junction-to-case and case-to-ambient thermal resistances. The case- JA thermal reference is defined at the solder mounting surface of the drain pins. R is guaranteed by design while R is JC CA 2 determined by the users board design. The R limit presented here is based on mounting on a 1 in pad of 2 oz copper. JA 1 Version: A1912 TQM150NB04DCR Taiwan Semiconductor ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V = 0V, I = 250A BV 40 -- -- GS D DSS V Gate Threshold Voltage V = V , I = 250A V 1.8 2.8 4 V GS DS D GS(TH) Gate-Source Leakage Current V = 20V, V = 0V I -- -- 100 nA GS DS GSS V = 0V, V = 40V -- -- 1 GS DS V = 0V, V = 40V GS DS -- -- 100 Drain-Source Leakage Current I A T = 125C DSS J V = 0V, V = 40V GS DS -- -- 500 T = 175C J V = 10V, I = 9A GS D -- 10.3 15 V = 10V, I = 9A GS D -- 17.5 25.5 Drain-Source On-State Resistance T = 125C J R m DS(on) (Note 3) V = 10V, I = 9A GS D -- 21.6 31.5 T = 175C J V = 7V, I = 6A -- 11.6 28.6 GS D (Note 3) V = 10V, I = 9A -- 38 -- Forward Transconductance DS D g S fs (Note 4) Dynamic V = 10V, V = 20V, GS DS Total Gate Charge Q -- 18 -- g I = 9A D Total Gate Charge Q -- 13 -- g nC V = 7V, V = 20V, GS DS Gate-Source Charge Q -- 6 -- gs I = 6A D Gate-Drain Charge Q -- 4 -- gd Input Capacitance C -- 1135 -- iss V = 0V, V = 20V, GS DS Output Capacitance C -- 112 -- pF oss f = 1.0MHz Reverse Transfer Capacitance C -- 52 -- rss Gate Resistance f = 1.0MHz R 0.8 2.5 5 g (Note 4) Switching Turn-On Delay Time t -- 7 -- d(on) Rise Time t -- 8 -- V = 10V, V = 20V, r GS DS ns Turn-Off Delay Time I = 9A, R = 2 t -- 13 -- D G d(off) Fall Time t -- 4 -- f Source-Drain Diode 3 (Note ) Diode Forward Voltage V -- -- 1.2 V V = 0V, I = 9A SD GS S Reverse Recovery Time t -- 14 -- ns rr I = 9A, S Reverse Recovery Charge Q -- 7 -- nC di/dt = 100A/s rr Notes: 1. Silicon limited current only. 2. L = 0.3mH, V = 10V, V = 25V, R = 50, I = 15A, Starting T = 25C GS DD G AS J 3. Pulse test: Pulse Width 300s, duty cycle 2%. 4. Switching time is essentially independent of operating temperature. 2 Version: A1912