2SK2614(TE16L1,Q)

2009-9 PRODUCT GUIDE MOSFETs CONTENTS ....................................................................... 1 Features and Structures 3 ........ 2 Toshibas MOSFET Product Lines and Part Numbering Schemes 4 ................................................................................... 2-1 MOSFET Product Lines 4 ................................................................................ 2-2 Part Numbering Schemes 5 ............................. 3 Selection Guide (By Absolute Maximum Ratings) 6 ................................. 4 Low-VDSS MOSFETs (in Small SMD Packages) 16 ......................................................................................... 4-1 Packaging Options 16 SSM Series TPC Series .................................................... 4-2 Application Examples and Block Diagrams 17 Cell Phone (Power Supply Circuit) Notebook PC (Power Supply Circuit) Lithium-Ion Secondary Battery (Battery Protection Circuits) Motor Driver (Power Driver Circuit) ..................................................................... 4-3 Low-VDSS MOSFET Roadmaps 19 Toshibas MOSFET devices Roadmap for Trench MOSFETs Package Options meet the needs of a wide range ................................................................. 4-4 Low-VDSS, High-Speed MOSFETs 21 Synchronous Rectification DC-DC Converters of ultra-high-density applications. Block Diagram, Timing Chart and Power Loss Factors Summary Results of Power Loss Simulation and Key Parameters for MOSFETs Efficiency Improvement by Thermally Enhanced Package and New Process Technology MOSBD (MOSFET with SBD) High-Speed MOSFET Offerings ......... 4-5 Low-VDSS, Low-RDS(ON) MOSFETs (for Lithium-Ion Battery Protection) 26 Lithium-Ion Battery Protection Circuit Trend MOSFET Roadmap Low-ON-resistance N-Channel Power MOSFETs Low-ON-resistance P-Channel Power MOSFETs .................................................................... 4-6 Semi-Power MOSFET Offerings 28 Semi-Power P-Channel Single MOSFETs Semi-Power N-Channel Single MOSFETs Semi-Power Dual MOSFETs MOSFET with a Schottky Barrier Diode VS-6 Series Part Number: TPC6xxx VS-8 Series Part Number: TPCF8xxx PS-8 Series Part Number: TPCP8xxx Chip LGA Series ... Part Number: TPCL4xxx STP2 Series ... Part Number: TPCT4xxx TSON Advance Series Part Number: TPCC8xxx TSSOP Advance Series Part Number: TPCM8xxx SOP-8 Series Part Number: TPC8xxx SOP Advance Series Part Number: TPCA8xxx DPAK Series ... Part Number: TKxxPxxxM1 ....................................................... 4-7 Standard MOSFET Series (ID < 500 mA) 36 Single MOSFETs Dual MOSFETs ............................................................. 5 Low-VDSS, High-Qg MOSFETs 37 ..................................................................................... 5-1 TO-220SM(W) Series 37 ......................................................................... 5-2 U-MOS (Trench Type) Series 38 ............ 5-3 U-MOS Series for Synchronous Rectification (VDSS = 60 V to 150 V) 39 .............................................................40 6 Mid- and High-VDSS MOSFETs ..................................................... 6-1 -MOSVII Series (VDSS = 450 V to 650 V) 40 ................................... 6-2 Super-Junction DTMOS Series (VDSS = 600 V, 650 V) 41 ....................................... 6-3 High-speed -MOS Series (VDSS = 450 V to 600 V) 42 ................................................................................................. 6-4 -MOS Series 43 ........................................................................ 7 MOSFET Part Numbers 46 ............................................................ 7-1 Alphanumeric Index of Part Numbers 46 ........................................................................ 8 Product Obsolescence 53 ...................................................................................... 8-1 End-of-Life Products 53 ............................................................................................. 9 Packaging 55 ................................................................ 9-1 Compact Surface-Mount Packages 55 ................................................................................. 9-2 Through-Hole Packages 66 2