8 mm SQJQ148E www.vishay.com Vishay Siliconix Automotive N-Channel 40 V (D-S) 175 C MOSFET FEATURES PowerPAKK 8 x 8L8 x 8L TrenchFET Gen IV power MOSFET AEC-Q101 qualified 100 % R and UIS tested D g Thin 1.6 mm package G Very low thermal resistance 1 S S Material categorization: 2 S S 3 for definitions of compliance please see S S 4 www.vishay.com/doc 99912 G 1 D Top View Bottom View PRODUCT SUMMARY V (V) 40 DS G R () at V = 10 V 0.0016 DS(on) GS I (A) 375 D Configuration Single S Package PowerPAK 8 x 8L N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-source voltage V 40 DS V Gate-source voltage V 20 GS T = 25 C 375 C Continuous drain current I D T = 125 C 190 C Continuous source current (diode conduction) I 195 A S b Pulsed drain current I 750 DM Single pulse avalanche current I 35 AS L = 0.1 mH Single pulse avalanche energy E 61 mJ AS T = 25 C 325 C Maximum power dissipation P W D T = 125 C 108 C Operating junction and storage temperature range T , T -55 to +175 J stg C d Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOLLIMITUNIT c Junction-to-ambient PCB mount R 44 thJA C/W Junction-to-case (drain) R 0.38 thJC Notes a. Package limited b. Pulse test pulse width 300 s, duty cycle 2 % c. When mounted on 1 square PCB (FR4 material) d. See solder profile (www.vishay.com/doc 73257). The end of the lead terminal is exposed copper (not plated) as a result of the singulatio n process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection S19-1115-Rev. A, 30-Dec-2019 Document Number: 77269 1 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 7.9 mm SQJQ148E www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0, I = 250 A 40 - - DS GS D V Gate-source threshold voltage V V = V , I = 250 A 2 3 3.5 GS(th) DS GS D Gate-source leakage I V = 0 V, V = 20 V - - 100 nA GSS DS GS V = 0 V V = 40 V - - 1 GS DS Zero gate voltage drain current I V = 0 V V = 40 V, T = 125 C - - 200 A DSS GS DS J V = 0 V V = 40 V, T = 175 C - - 330 GS DS J a On-state drain current I V = 10 V V 5 V 100 - - A D(on) GS DS V = 10 V I = 20 A - 0.0013 0.0016 GS D a Drain-source on-state resistance R V = 10 V I = 20 A, T = 125 C - - 0.0024 DS(on) GS D J V = 10 V I = 20 A, T = 175 C - - 0.0028 GS D J b Forward transconductance g V = 15 V, I = 60 A - 160 - S fs DS D b Dynamic Input capacitance C - 3950 4930 iss Output capacitance C -V = 0 V V = 25 V, f = 1 MHz14501810 pF oss GS DS Reverse transfer capacitance C -77100 rss c Total gate charge Q -69 86 g c Gate-source charge Q -3V = 10 V V = 20 V, I = 30 A5- nC gs GS DS D c Gate-drain charge Q -24- gd Gate resistance R f = 1 MHz 0.8 1.6 2.6 g c Turn-on delay time t -17 24 d(on) c Rise time t -41 57 r V = 20 V, R = 1 DD L ns c I 20 A, V = 10 V, R = 1 Turn-off delay time t -3D GEN g 244 d(off) c Fall time t -1217 f b Source-Drain Diode Ratings and Characteristics Reverse recovery time t -45 - ns rr V = 32 V, I = 15 A, DD FM Reverse recovery charge Q -39 - nC rr di/dt = 100 A/s Reverse recovery current I -- 2.1 A RM a Pulsed current I - - 1600 A SM Forward voltage V I = 50 A, V = 0 - 0.8 1.1 V SD F GS Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S19-1115-Rev. A, 30-Dec-2019 Document Number: 77269 2 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000