W29N02KVSIAF TR Winbond

Name: W29N02KVSIAF TR
Brand: Winbond
SKU: W29N02KVSIAFTR_Winbond
Availability: InStock
Rating: 5 (11 reviews)

W29N02KVSIAF TR electronic component of Winbond

Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W29N02KVSIAF TR NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N02KVSIAF TR NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

Part No.	W29N02KVSIAF TR
Manufacturer:	Winbond
Category:	NAND Flash
Description:	NAND Flash 2G-bit Serial NAND flash, 3V, 4-bit ECC, 3V, x8
Datasheet:	W29N02KVSIAF TR Datasheet (PDF)

Price (USD)

1: USD 6.2375 ea
Line Total: USD 6.24

Availability : 1087

Ship by Mon. 24 Nov to Wed. 26 Nov

Qty Unit Price
1 $ 6.2375
10 $ 5.203
25 $ 5.049
50 $ 4.983
100 $ 4.862
250 $ 4.763
500 $ 4.708
1000 $ 4.686
1500 $ 4.675

W29N02KVSIAF TR More Buying Options & Price Grid(s)

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Availability

Price (USD)

Buy Price

Quantity

Availability 1087

Ship by Mon. 24 Nov to Wed. 26 Nov

MOQ : 1
Multiples : 1

Qty Unit Price
1 $ 6.2375
10 $ 5.203
25 $ 5.049
50 $ 4.983
100 $ 4.862
250 $ 4.763
500 $ 4.708
1000 $ 4.686
1500 $ 4.675

Specifications

Manufacturer

Winbond Winbond

Product Category

NAND Flash NAND Flash

Mounting Style

SMD/SMT SMD/SMT

Series

W29N02KV W29N02KV

Memory Size

2 Gbit 2 Gbit

Organisation

256 M x 8 256 M x 8

Data Bus Width

8 bit 8 bit

Supply Voltage - Min

2.7 V 2.7 V

Supply Voltage - Max

3.6 V 3.6 V

Minimum Operating Temperature

- 40 C - 40 C

Maximum Operating Temperature

+ 85 C + 85 C

Packaging

Reel , Cut Tape Reel , Cut Tape

Notes:- Show Stocked Products With Similar Attributes.

W29N02KVSIAF TR Alternative Parts

We are delighted to provide the W29N02KVSIAF TR from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N02KVSIAF TR and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N02KVxxAF W29N02KVxxAF 2G-BIT 3.3V NAND FLASH MEMORY th Release Date: November 7 , 2018 1 Revision A W29N02KVxxAF Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin Assignment 48-pin TSOP1(x8) ....................................................................................... 8 3.2 Pin Assignment 48 ball VFBGA (x8) ..................................................................................... 9 3.3 Pin Assignment 63 ball VFBGA (x8) ................................................................................... 10 3.4 Pin Descriptions .................................................................................................................. 11 4. PIN DESCRITPIONS ................................................................................................................... 12 4.1 Chip Enable ( CE) .............................................................................................................. 12 4.2 Write Enable ( WE) ............................................................................................................ 12 4.3 Read Enable ( RE) ............................................................................................................. 12 4.4 Address Latch Enable (ALE) .............................................................................................. 12 4.5 Command Latch Enable (CLE) ........................................................................................... 12 4.6 Write Protect ( WP) ............................................................................................................ 12 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 12 4.8 Input and Output (I/Ox) ....................................................................................................... 12 5. BLOCK DIAGRAM ....................................................................................................................... 13 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 14 6.1 Array Organization (x8) ....................................................................................................... 14 7. MODE SELECTION TABLE ........................................................................................................ 15 8. COMMAND TABLE ...................................................................................................................... 16 9. DEVICE OPERATIONS ............................................................................................................... 17 9.1 READ Operation ................................................................................................................. 17 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 17 9.1.2 TWO PLANE READ (00h-00h-30h) ...................................................................................... 17 9.1.3 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 19 9.1.4 READ ID (90h) ...................................................................................................................... 20 9.1.5 READ PARAMETER PAGE (ECh) ....................................................................................... 21 9.1.6 READ STATUS (70h) ........................................................................................................... 23 9.1.7 READ STATUS ENHANCED (78h) ...................................................................................... 25 9.1.8 READ UNIQUE ID (EDh) ...................................................................................................... 26 9.2 PROGRAM Operation ........................................................................................................ 27 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 27 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 27 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 28 9.2.4 TWO PLANE PAGE PROGRAM .......................................................................................... 29 9.3 COPY BACK Operation ...................................................................................................... 30 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 30 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 31 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 32 9.3.4 TWO PLANE PROGRAM for COPY BACK .......................................................................... 32 9.4 BLOCK ERASE Operation .................................................................................................. 36 9.4.1 BLOCK ERASE (60h-D0h) ................................................................................................... 36 th Release Date: November 7 , 2018 2 Revision A

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Qty	Unit Price
1	$ 6.2375
10	$ 5.203
25	$ 5.049
50	$ 4.983
100	$ 4.862
250	$ 4.763
500	$ 4.708
1000	$ 4.686
1500	$ 4.675

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