W949D2DBJX5I Winbond

W949D2DBJX5I electronic component of Winbond
W949D2DBJX5I Winbond
W949D2DBJX5I DRAM
W949D2DBJX5I  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of W949D2DBJX5I DRAM across the USA, India, Europe, Australia, and various other global locations. W949D2DBJX5I DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

Part No. W949D2DBJX5I
Manufacturer: Winbond
Category: DRAM
Description: DRAM 512Mb LPDDR, x32, 200MHz, Industrial Temp, 46nm
Datasheet: W949D2DBJX5I Datasheet (PDF)
Price (USD)
240: USD 2.7258 ea
Line Total: USD 654.19 
Availability : 0
  
QtyUnit Price
240$ 2.7258
480$ 2.6796
1200$ 2.6334

Availability 0
Ship by Fri. 01 Aug to Thu. 07 Aug
MOQ : 240
Multiples : 1
QtyUnit Price
240$ 4.0268
250$ 3.9861
500$ 3.9467
1000$ 3.9073
2000$ 3.8679
2500$ 3.8299
3000$ 3.7918
4000$ 3.7537
5000$ 3.7157
10000$ 3.6789


Availability 0
Ship by Wed. 30 Jul to Fri. 01 Aug
MOQ : 240
Multiples : 240
QtyUnit Price
240$ 2.7258
480$ 2.6796
1200$ 2.6334


Availability 0
Ship by Fri. 01 Aug to Thu. 07 Aug
MOQ : 3
Multiples : 1
QtyUnit Price
3$ 4.0529

   
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We are delighted to provide the W949D2DBJX5I from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W949D2DBJX5I and other electronic components in the DRAM category and beyond.

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W949D6DB / W949D2DB 512Mb Mobile LPDDR Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................................. 4 2. FEATURES ........................................................................................................................................................ 4 3. ORDER INFORMATION .................................................................................................................................... 4 4. BALL ASSIGNMENT .......................................................................................................................................... 5 4.1 60VFBGA Ball Assignment: LPDDR x16 .............................................................................................. 5 4.2 90VFBGA Ball Assignment: LPDDR x32 .............................................................................................. 5 5. BALL CONFIGURATION .................................................................................................................................... 6 5.1 Ball description ..................................................................................................................................... 6 5.2 Addressing Table ................................................................................................................................. 7 6. BLOCK DIAGRAM .............................................................................................................................................. 8 6.1 Block Diagram ...................................................................................................................................... 8 6.2 Simplified State Diagram ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION ......................................................................................................................... 10 7.1 Initialization ......................................................................................................................................... 10 7.1.1 Initialization Flow Diagram .................................................................................................... 11 7.1.2 Initialization Waveform Sequence ........................................................................................ 12 7.2 Mode Register Set Operation ............................................................................................................. 12 7.3 Mode Register Definition .................................................................................................................... 13 7.3.1 Burst Length ......................................................................................................................... 13 7.3.2 Burst Definition ..................................................................................................................... 14 7.3.3 Burst Type ............................................................................................................................ 15 7.3.4 Read Latency ....................................................................................................................... 15 7.4 Extended Mode Register Description ................................................................................................. 15 7.4.1 Extended Mode Register Definition ...................................................................................... 16 7.4.2 Partial Array Self Refresh ..................................................................................................... 16 7.4.3 Automatic Temperature Compensated Self Refresh ............................................................ 16 7.4.4 Output Drive Strength ........................................................................................................... 16 7.5 Status Register Read ......................................................................................................................... 17 7.5.1 SRR Register Definition........................................................................................................ 17 7.5.2 Status Register Read Timing Diagram ................................................................................. 18 7.6 Commands ......................................................................................................................................... 19 7.6.1 Basic Timing Parameters for Commands ............................................................................. 19 7.6.2 Truth Table Commands ..................................................................................................... 19 7.6.3 Truth Table - DM Operations ................................................................................................ 20 7.6.4 Truth Table CKE ................................................................................................................ 20 7.6.5 Truth Table - Current State Bank n - Command to Bank n ................................................... 21 7.6.6 Truth Table - Current State Bank n, Command to Bank m ................................................... 22 8. OPERATION .................................................................................................................................................... 24 8.1 Deselect ............................................................................................................................................. 24 8.2 No Operation ...................................................................................................................................... 24 8.2.1 NOP Command .................................................................................................................... 24 8.3 Mode Register Set .............................................................................................................................. 25 8.3.1 Mode Register Set Command .............................................................................................. 25 8.3.2 Mode Register Set Command Timing .................................................................................. 25 8.4 Active .................................................................................................................................................. 26 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 1 - W949D6DB / W949D2DB 8.4.1 Active Command .................................................................................................................. 26 8.4.2 Bank Activation Command Cycle ......................................................................................... 27 8.5 Read ................................................................................................................................................... 27 8.5.1 Read Command ................................................................................................................... 27 8.5.2 Basic Read Timing Parameters ............................................................................................ 28 8.5.3 Read Burst Showing CAS Latency ....................................................................................... 29 8.5.4 Read to Read ....................................................................................................................... 29 8.5.5 Consecutive Read Bursts ..................................................................................................... 29 8.5.6 Non-Consecutive Read Bursts ............................................................................................. 30 8.5.7 Random Read Bursts ........................................................................................................... 31 8.5.8 Read Burst Terminate .......................................................................................................... 31 8.5.9 Read to Write ....................................................................................................................... 32 8.5.10 Read to Precharge ............................................................................................................... 33 8.5.11 Burst Terminate of Read ...................................................................................................... 34 8.6 Write ................................................................................................................................................... 34 8.6.1 Write Command ................................................................................................................... 34 8.6.2 Basic Write Timing Parameters ............................................................................................ 35 8.6.3 Write Burst (min. and max. tDQSS) ...................................................................................... 36 8.6.4 Write to Write ........................................................................................................................ 36 8.6.5 Concatenated Write Bursts ................................................................................................... 37 8.6.6 Non-Concatenated Write Bursts ........................................................................................... 37 8.6.7 Random Write Cycles ........................................................................................................... 38 8.6.8 Write to Read ....................................................................................................................... 38 8.6.9 Non-Interrupting Write to Read ............................................................................................. 38 8.6.10 Interrupting Write to Read .................................................................................................... 39 8.6.11 Write to Precharge ............................................................................................................... 39 8.6.12 Non-Interrupting Write to Precharge ..................................................................................... 39 8.6.13 Interrupting Write to Precharge ............................................................................................ 40 8.7 Precharge ........................................................................................................................................... 40 8.7.1 Precharge Command ........................................................................................................... 41 8.8 Auto Precharge .................................................................................................................................. 41 8.9 Refresh Requirements ........................................................................................................................ 41 8.10 Auto Refresh ...................................................................................................................................... 42 8.10.1 Auto Refresh Command ....................................................................................................... 42 8.10.2 Auto Refresh Cycles Back-to-Back ...................................................................................... 42 8.11 Self Refresh ........................................................................................................................................ 43 8.11.1 Self Refresh Command ........................................................................................................ 43 8.11.2 Self Refresh Entry and Exit .................................................................................................. 44 8.12 Power Down ....................................................................................................................................... 45 8.12.1 Power-Down Entry and Exit .................................................................................................. 45 8.13 Deep Power Down.............................................................................................................................. 46 8.13.1 Deep Power-Down Entry and Exit ........................................................................................ 46 8.14 Clock Stop .......................................................................................................................................... 47 8.14.1 Clock Stop Mode Entry and Exit ........................................................................................... 47 9. ELECTRICAL CHARACTERISTICS ................................................................................................................. 48 9.1 Absolute Maximum Ratings ................................................................................................................ 48 9.2 Input / Output Capacitance ................................................................................................................. 48 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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