X-On Electronics has gained recognition as a prominent supplier of W949D6DBHX5E dram across the USA, India, Europe, Australia, and various other global locations. W949D6DBHX5E dram are a product manufactured by Winbond. We provide cost-effective solutions for dram, ensuring timely deliveries around the world.

W949D6DBHX5E Winbond

W949D6DBHX5E electronic component of Winbond
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See Product Specifications
Part No.W949D6DBHX5E
Manufacturer: Winbond
Category:DRAM
Description: IC LPDDR SDRAM 512MBIT 60VFBGA
Datasheet: W949D6DBHX5E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.0988 ea
Line Total: USD 4.1

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 10 Jun to Fri. 14 Jun

MOQ : 312
Multiples : 1
312 : USD 3.4412

0 - WHS 2


Ships to you between Fri. 14 Jun to Tue. 18 Jun

MOQ : 1
Multiples : 1
1 : USD 3.9727
10 : USD 3.6104
100 : USD 3.1516
250 : USD 3.1395
500 : USD 3.0188
936 : USD 2.8738
2808 : USD 2.729
5304 : USD 2.4874
10296 : USD 2.415

0 - WHS 3


Ships to you between Mon. 10 Jun to Fri. 14 Jun

MOQ : 4
Multiples : 4
4 : USD 2.8251

     
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We are delighted to provide the W949D6DBHX5E from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W949D6DBHX5E and other electronic components in the DRAM category and beyond.

W949D6DB / W949D2DB 512Mb Mobile LPDDR Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................................. 4 2. FEATURES ........................................................................................................................................................ 4 3. ORDER INFORMATION .................................................................................................................................... 4 4. BALL ASSIGNMENT .......................................................................................................................................... 5 4.1 60VFBGA Ball Assignment: LPDDR x16 .............................................................................................. 5 4.2 90VFBGA Ball Assignment: LPDDR x32 .............................................................................................. 5 5. BALL CONFIGURATION .................................................................................................................................... 6 5.1 Ball description ..................................................................................................................................... 6 5.2 Addressing Table ................................................................................................................................. 7 6. BLOCK DIAGRAM .............................................................................................................................................. 8 6.1 Block Diagram ...................................................................................................................................... 8 6.2 Simplified State Diagram ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION ......................................................................................................................... 10 7.1 Initialization ......................................................................................................................................... 10 7.1.1 Initialization Flow Diagram .................................................................................................... 11 7.1.2 Initialization Waveform Sequence ........................................................................................ 12 7.2 Mode Register Set Operation ............................................................................................................. 12 7.3 Mode Register Definition .................................................................................................................... 13 7.3.1 Burst Length ......................................................................................................................... 13 7.3.2 Burst Definition ..................................................................................................................... 14 7.3.3 Burst Type ............................................................................................................................ 15 7.3.4 Read Latency ....................................................................................................................... 15 7.4 Extended Mode Register Description ................................................................................................. 15 7.4.1 Extended Mode Register Definition ...................................................................................... 16 7.4.2 Partial Array Self Refresh ..................................................................................................... 16 7.4.3 Automatic Temperature Compensated Self Refresh ............................................................ 16 7.4.4 Output Drive Strength ........................................................................................................... 16 7.5 Status Register Read ......................................................................................................................... 17 7.5.1 SRR Register Definition........................................................................................................ 17 7.5.2 Status Register Read Timing Diagram ................................................................................. 18 7.6 Commands ......................................................................................................................................... 19 7.6.1 Basic Timing Parameters for Commands ............................................................................. 19 7.6.2 Truth Table Commands ..................................................................................................... 19 7.6.3 Truth Table - DM Operations ................................................................................................ 20 7.6.4 Truth Table CKE ................................................................................................................ 20 7.6.5 Truth Table - Current State Bank n - Command to Bank n ................................................... 21 7.6.6 Truth Table - Current State Bank n, Command to Bank m ................................................... 22 8. OPERATION .................................................................................................................................................... 24 8.1 Deselect ............................................................................................................................................. 24 8.2 No Operation ...................................................................................................................................... 24 8.2.1 NOP Command .................................................................................................................... 24 8.3 Mode Register Set .............................................................................................................................. 25 8.3.1 Mode Register Set Command .............................................................................................. 25 8.3.2 Mode Register Set Command Timing .................................................................................. 25 8.4 Active .................................................................................................................................................. 26 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 1 - W949D6DB / W949D2DB 8.4.1 Active Command .................................................................................................................. 26 8.4.2 Bank Activation Command Cycle ......................................................................................... 27 8.5 Read ................................................................................................................................................... 27 8.5.1 Read Command ................................................................................................................... 27 8.5.2 Basic Read Timing Parameters ............................................................................................ 28 8.5.3 Read Burst Showing CAS Latency ....................................................................................... 29 8.5.4 Read to Read ....................................................................................................................... 29 8.5.5 Consecutive Read Bursts ..................................................................................................... 29 8.5.6 Non-Consecutive Read Bursts ............................................................................................. 30 8.5.7 Random Read Bursts ........................................................................................................... 31 8.5.8 Read Burst Terminate .......................................................................................................... 31 8.5.9 Read to Write ....................................................................................................................... 32 8.5.10 Read to Precharge ............................................................................................................... 33 8.5.11 Burst Terminate of Read ...................................................................................................... 34 8.6 Write ................................................................................................................................................... 34 8.6.1 Write Command ................................................................................................................... 34 8.6.2 Basic Write Timing Parameters ............................................................................................ 35 8.6.3 Write Burst (min. and max. tDQSS) ...................................................................................... 36 8.6.4 Write to Write ........................................................................................................................ 36 8.6.5 Concatenated Write Bursts ................................................................................................... 37 8.6.6 Non-Concatenated Write Bursts ........................................................................................... 37 8.6.7 Random Write Cycles ........................................................................................................... 38 8.6.8 Write to Read ....................................................................................................................... 38 8.6.9 Non-Interrupting Write to Read ............................................................................................. 38 8.6.10 Interrupting Write to Read .................................................................................................... 39 8.6.11 Write to Precharge ............................................................................................................... 39 8.6.12 Non-Interrupting Write to Precharge ..................................................................................... 39 8.6.13 Interrupting Write to Precharge ............................................................................................ 40 8.7 Precharge ........................................................................................................................................... 40 8.7.1 Precharge Command ........................................................................................................... 41 8.8 Auto Precharge .................................................................................................................................. 41 8.9 Refresh Requirements ........................................................................................................................ 41 8.10 Auto Refresh ...................................................................................................................................... 42 8.10.1 Auto Refresh Command ....................................................................................................... 42 8.10.2 Auto Refresh Cycles Back-to-Back ...................................................................................... 42 8.11 Self Refresh ........................................................................................................................................ 43 8.11.1 Self Refresh Command ........................................................................................................ 43 8.11.2 Self Refresh Entry and Exit .................................................................................................. 44 8.12 Power Down ....................................................................................................................................... 45 8.12.1 Power-Down Entry and Exit .................................................................................................. 45 8.13 Deep Power Down.............................................................................................................................. 46 8.13.1 Deep Power-Down Entry and Exit ........................................................................................ 46 8.14 Clock Stop .......................................................................................................................................... 47 8.14.1 Clock Stop Mode Entry and Exit ........................................................................................... 47 9. ELECTRICAL CHARACTERISTICS ................................................................................................................. 48 9.1 Absolute Maximum Ratings ................................................................................................................ 48 9.2 Input / Output Capacitance ................................................................................................................. 48 Publication Release Date: Jun. 01, 2018 Revision: A01-004 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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