AC857BQ-AC857CQ PNP SMALL SIGNAL TRANSISTOR IN SOT23 Description Mechanical Data Case: SOT23 The AC857BQ-AC857CQ Bipolar Junction Transistors (BJT) are Case Material: Molded Plastic, Green Molding Compound designed to meet the stringent requirements of Automotive UL Flammability Classification Rating 94V-0 Applications. Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish Matte Tin Plated Leads, Solderable per Features MIL-STD-202, Method 208 Weight: 0.008 grams (Approximate) Ideally Suited for Automatic Insertion Complementary NPN Types: AC847BQ-AC847CQ For Switching and AF Amplifier Applications Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) C SOT23 C B B E E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel Size (inches) Quantity per Reel AC857BQ-7 Automotive 2C6 7 3,000 AC857CQ-7 Automotive 2C7 7 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See AC857BQ-AC857CQ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -50 V V CBO Collector-Emitter Voltage -45 V V CEO Emitter-Base Voltage V -5.0 V EBO Continuous Collector Current I -100 mA C Peak Collector Current I -200 mA CM Peak Emitter Current I -200 mA EM Peak Base Current I -200 mA BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation mW P D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient C/W R JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) R 350 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted on 15mm x 15mm 1oz copper. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 AC857BQ-AC857CQ April 2017 Diodes Incorporated www.diodes.com Document Number: DS39359 Rev. 3 - 2