Product Information

DMC1030UFDBQ-13

DMC1030UFDBQ-13 electronic component of Diodes Incorporated

Datasheet
MOSFET MOSFET BVDSS:

Manufacturer: Diodes Incorporated
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

10000: USD 0.2425 ea
Line Total: USD 2425

0 - Global Stock
MOQ: 10000  Multiples: 10000
Pack Size: 10000
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Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

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DMC1030UFDBQ-13
Diodes Incorporated

1 : USD 0.7238
10 : USD 0.6217
100 : USD 0.4639
500 : USD 0.3654
1000 : USD 0.2824
2500 : USD 0.2575
10000 : USD 0.2349

     
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DMC1030UFDBQ COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET Product Summary Features Low On-Resistance I D MAX Device BV R DSS DS(ON) MAX Low Input Capacitance T = +25C A Low Profile, 0.6mm Max Height 34m @ V = 4.5V 5.1A GS ESD Protected Gate 40m @ V = 2.5V 4.7A Q1 GS 12V Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) N-Channel 50m @ V = 1.8V 4.2A GS Halogen and Antimony Free. Green Device (Note 3) 3.6A 70m @ VGS = 1.5V Qualified to AEC-Q101 Standards for High Reliability -3.9A 59m @ V = -4.5V GS PPAP Capable (Note 4) -3.3A 81m @ V = -2.5V Q2 GS -12 P-Channel 115m @ V = -1.8V -2.8A GS Mechanical Data 215m @ V = -1.5V -2.0A GS Case: U-DFN2020-6 (Type B) Case Material: Molded Plastic, Green Molding Compound. Description and Applications UL Flammability Classification Rating 94V-0 This MOSFET is designed to meet the stringent requirements of Moisture Sensitivity: Level 1 per J-STD-020 Automotive applications. It is qualified to AEC-Q101, supported by a Terminals: Finish NiPdAu over Copper Leadframe. Solderable PPAP and is ideal for use in: per MIL-STD-202, Method 208 e4 Terminals Connections: See Diagram Below Load Switch Weight: 0.0065 grams (Approximate) Power Management Functions U-DFN2020-6 (Type B) Portable Power Adaptors D1 D2 S2 G2 D2 DD1 G1 G2 D1 D2 G1 Gate Protection Gate Protection ESD PROTECTED S1 S1 S2 Diode Diode Pin1 N-CHANNEL MOSFET P-CHANNEL MOSFET Bottom View Internal Schematic Ordering Information (Note 5) Part Number Case Packaging DMC1030UFDBQ-7 U-DFN2020-6 (Type B) 3000/Tape & Reel DMC1030UFDBQ-13 U-DFN2020-6 (Type B) 10000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DMC1030UFDBQ Maximum Ratings (@T = +25C, unless otherwise specified.) A Q1 Q2 Characteristic Symbol Unit N-CHANNEL P-CHANNEL Drain-Source Voltage 12 -12 V V DSS Gate-Source Voltage V 8 8 V GSS Steady T = +25C 5.1 -3.9 A Continuous Drain Current (Note 6) I A D State 4.1 -3.1 TA = +70C N-CHANNEL: VGS = 4.5V 6.6 -5.0 T = +25C A t < 5s A P-CHANNEL: V = -4.5V I GS D 5.3 -4.0 T = +70C A -1.7 Maximum Continuous Body Diode Forward Current (Note 6) I 2 A S Pulsed Drain Current (10s Pulse, Duty Cycle = 1%) I 35 -25 A DM 5 -5 Avalanche Current (L = 0.1mH) I A AS 4 4 Avalanche Energy (L = 0.1mH) E mJ AS Thermal Characteristics Characteristic Symbol Value Unit Steady State 1.36 Total Power Dissipation (Note 6) W P D t < 5s 1.89 Steady State 92 Thermal Resistance, Junction to Ambient (Note 6) R JA t < 5s 66 C/W Thermal Resistance, Junction to Case (Note 6) 18 R JC Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics Q1 N-CHANNEL (@ T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BV 12 V V = 0V, I = 250A DSS GS D Zero Gate Voltage Drain Current T = +25C 1.0 A J I V = 12V, V = 0V DSS DS GS Gate-Source Leakage 10 A I V = 8V, V = 0V GSS GS DS ON CHARACTERISTICS (Note 7) Gate Threshold Voltage 0.4 1 V V V = V , I = 250A GS(TH) DS GS D 17 34 V = 4.5V, I = 4.6A GS D 20 40 V = 2.5V, I = 4.2A GS D Static Drain-Source On-Resistance m R DS(ON) 24 50 V = 1.8V, I = 3.8A GS D 28 70 V = 1.5V, I = 1.5A GS D Diode Forward Voltage V 0.7 1.2 V V = 0V, I = 4.8A SD GS S DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance C 1003 pF iss V = 6V, V = 0V, DS GS Output Capacitance C 132 pF oss f = 1.0MHz Reverse Transfer Capacitance C 115 pF rss Gate Resistance 11.3 R V = 0V, V = 0V, f = 1MHz g DS GS 12.2 nC Total Gate Charge (V = 4.5V) GS Q g 23.1 nC Total Gate Charge (V = 8V) GS V = 10V, I = 6.8A DS D Gate-Source Charge 1.3 nC Q gs Gate-Drain Charge 1.5 nC Q gd Turn-On Delay Time 4.4 ns t D(ON) Turn-On Rise Time 7.4 ns t V = 6V, V = 4.5V, R DD GS Turn-Off Delay Time 18.8 ns t R = 1.1, R = 1 D(OFF) L G Turn-Off Fall Time 4.9 ns t F Body Diode Reverse Recovery Time 7.6 ns I = 5.4A, dI/dt = 100A/s t S RR Body Diode Reverse Recovery Charge 0.9 nC Q I = 5.4A, dI/dt = 100A/s RR S Notes: 6. Device mounted on 1 x 1 FR-4 PCB with high coverage 2oz. Copper, single sided. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. 2 of 9 DMC1030UFDBQ January 2016 Diodes Incorporated www.diodes.com Document number: DS38242 Rev.1 - 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
DIO
Diodes
DIODES INC
DIODES INC / ZETEX
DIODES INC.
Diodes Inc. / Pericom
Diodes Zetex
DiodesZetex
PAM(Diodes Inc)
PER
Pericom
PERICOM SEMI
Pericom Semiconductor
Pericom Technology
Pericom/Diodes
ZTX

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