DMN3009SSS-13 Diodes Incorporated

DMN3009SSS-13 electronic component of Diodes Incorporated
DMN3009SSS-13 Diodes Incorporated
DMN3009SSS-13 MOSFETs
DMN3009SSS-13  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of DMN3009SSS-13 MOSFETs across the USA, India, Europe, Australia, and various other global locations. DMN3009SSS-13 MOSFETs are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

Part No. DMN3009SSS-13
Manufacturer: Diodes Incorporated
Category: MOSFETs
Description: MOSFET MOSFET BVDSS: 8V-24V
Datasheet: DMN3009SSS-13 Datasheet (PDF)
Price (USD)
1: USD 1.05 ea
Line Total: USD 1.05 
Availability : 2305
  
Ship by Wed. 27 Aug to Fri. 29 Aug
QtyUnit Price
1$ 1.05
10$ 0.6912
100$ 0.4103
500$ 0.3267
1000$ 0.2948
2500$ 0.253
5000$ 0.2365

Availability 2305
Ship by Wed. 27 Aug to Fri. 29 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.05
10$ 0.6912
100$ 0.4103
500$ 0.3267
1000$ 0.2948
2500$ 0.253
5000$ 0.2365

   
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the DMN3009SSS-13 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DMN3009SSS-13 and other electronic components in the MOSFETs category and beyond.

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DMN3009SSS 30V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-Resistance I max D BV R max DSS DS(ON) Low Input Capacitance T = +25C A Fast Switching Speed 5.5m V = 10V 15A GS 100% Unclamped Inductive Switching (UIS) Test in Production 30V Ensures More Reliable and Robust End Application 7.5m V = 4.5V 12A GS Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Description and Applications Mechanical Data This MOSFET is designed to minimize the on-state resistance (R ) yet maintain superior switching performance, making it ideal DS(ON) Case: SO-8 for high-efficiency power management applications. Case Material: Molded Plastic,Gree Molding Compound. UL Flammability Classification Rating 94V-0 Motor Control Moisture Sensitivity: Level 3 per J-STD-020 Backlighting Terminal Connections Indicator: See Diagram Below Power Management Functions Terminals: Finish Matte Tin Annealed over Copper Leadframe. DC-DC Converters Solderable per MIL-STD-202, Method 208 Weight: 0.074 grams (Approximate) SO-8 D S D S D S D G G D S Top View Top View Internal Schematic Equivalent Circuit Ordering Information (Note 4) Part Number Case Packaging DMN3009SSS-13 SO-8 2500/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See DMN3009SSS Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 30 V DSS Gate-Source Voltage V 20 V GSS Steady T = +25C 15 A Continuous Drain Current (Note 6) V = 10V I A GS D State 12 T = +70C A Pulsed Drain Current (10s Pulse, Duty Cycle = 1%) 80 A I DM Maximum Continuous Body Diode Forward Current (Note 6) 2.7 A I S Avalanche Current (Note 7) L = 0.1mH 33 A I AS Avalanche Energy (Note 7) L = 0.1mH 55 mJ E AS Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Steady State Total Power Dissipation (Note 5) 1.4 W T = +25C P A D Thermal Resistance, Junction to Ambient (Note 5) Steady State 101 C/W R JA Total Power Dissipation (Note 6) Steady State 1.8 W T = +25C P A D Thermal Resistance, Junction to Ambient (Note 6) Steady State 73 R JA C/W Thermal Resistance, Junction to Case (Note 6) 7.6 R JC Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage 30 V BVDSS VGS = 0V, ID = 250A Zero Gate Voltage Drain Current 1 A I V = 30V, V = 0V DSS DS GS Gate-Source Leakage 100 nA I V = 20V, V = 0V GSS GS DS ON CHARACTERISTICS (Note 8) Gate Threshold Voltage 1 1.5 2.5 V V V = V , I = 250A GS(TH) DS GS D 4.5 5.5 V = 10V, I = 15A GS D Static Drain-Source On-Resistance R m DS(ON) 5.5 7.5 V = 4.5V, I = 15A GS D Diode Forward Voltage 0.75 1.2 V V V = 0V, I = 1A SD GS S DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance C 2,000 pF iss V = 15V, V = 0V, DS GS 315 Output Capacitance C pF oss f = 1.0MHz 247 Reverse Transfer Capacitance C pF rss 2.2 Gate Resistance R V = 0V, V = 0V, f = 1.0MHz g DS GS 20 nC Total Gate Charge (VGS = 4.5V) Qg 42 nC Total Gate Charge (V = 10V) Q GS g V = 15V, I = 15A DS D Gate-Source Charge 4.7 nC Q gs Gate-Drain Charge 7.4 nC Q gd Turn-On Delay Time 3.9 ns t D(ON) Turn-On Rise Time 4.1 ns t V = 15V, V = 10V, R DD GS 31 Turn-Off Delay Time t ns R = 3.3, I = 15A D(OFF) G D 15 Turn-Off Fall Time t ns F 15 Reverse Recovery Time t ns RR I = 15A, di/dt = 100A/s F 6.0 Reverse Recovery Charge Q nC RR Notes: 5. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 6. Device mounted on FR-4 substrate PCB, 2oz copper, with 1inch square copper plate. 7. I and E ratings are based on low frequency and duty cycles to keep T = +25C. AS AS J 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. 2 of 7 DMN3009SSS August 2019 Diodes Incorporated www.diodes.com Document number: DS40792 Rev. 4 - 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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