A Product Line of Diodes Incorporated Green FZT489 30V NPN MEDIUM POWER TRANSISTOR IN SOT223 Features Mechanical Data BV > 30V Case: SOT223 CEO I = 1A High Continuous Current C Case material: Molded Plastic. Green Molding Compound I = 4A Peak Pulse Current CM UL Flammability Rating 94V-0 Low Saturation Voltage Moisture Sensitivity: Level 1 per J-STD-020 Complementary PNP Type: FZT589 Terminals: Finish - Matte Tin Plated Leads, Solderable per Lead-Free Finish RoHS Compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.112 grams (Approximate) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) C SOT223 B E Top View Top View Device Symbol Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FZT489TA AEC-Q101 FZT489 7 12 1,000 FZT489QTA Automotive FZT489 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT489 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 50 V CBO Collector-Emitter Voltage 30 V VCEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 1 A I C Base Current 200 mA I B Peak Pulse Current 4 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 3.0 (Note 7) 2.0 Power Dissipation P W D (Note 8) 1.6 (Note 9) 1.2 (Note 6) 41.7 (Note 7) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 8) 78.1 C/W (Note 9) 104 Thermal Resistance Junction to Lead (Note 10) R 19.4 JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted on 25mm x 25mm 2oz copper. 8. Same as Note 6, except the device is mounted on 25mm x 25mm 1oz copper. 9. Same as Note 6, except the device is mounted on minimum recommended pad layout. 10. Thermal resistance from junction to solder-point (at the end of the collector lead). 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT489 March 2015 Diodes Incorporated www.diodes.com Document Number DS33134 Rev. 5 - 2