A Product Line of Diodes Incorporated Green FZT757 300V PNP HIGH VOLTAGE TRANSISTOR IN SOT223 Features Mechanical Data BV > -300V Case: SOT223 CEO I = -0.5A Continuous Current C Case Material: Molded Plastic. Green Molding Compound I = -1A Peak Pulse Current CM UL Flammability Rating 94V-0 Complementary NPN Type: FZT657 Moisture Sensitivity: Level 1 per J-STD-020 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Terminals: Finish - Matte Tin Plated Leads Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.112 grams (Approximate) SOT223 C E B C C B E Top View Top View Pin-Out Device Symbol Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FZT757TA AEC-Q101 FZT757 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT757 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -300 V V CBO Collector-Emitter Voltage -300 V V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -0.5 A I C Peak Pulse Current I -1 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.0 (Note 6) 2.0 Power Dissipation P W D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient C/W R JA (Note 7) 78.1 (Note 8) 104 Thermal Resistance, Junction to Leads (Note 9) R 12.9 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class 3A Electrostatic Discharge - Human Body Model ESD HBM 4,000 V C Electrostatic Discharge - Machine Model ESD MM 400 V Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 March 2015 FZT757 Diodes Incorporated www.diodes.com Document Number DS33165 Rev. 6 - 2