ZXTP2006E6 20V PNP LOW SATURATION MEDIUM POWER TRANSISTOR IN SOT26 Features Mechanical Data BV > -20V Case: SOT26 CEO I = -3.5A Max Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound. C I = -10A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM R = 31m for a low equivalent On-Resistance Moisture Sensitivity: Level 1 per J-STD-020 CE(SAT) Low Saturation Voltage (-70mV max 1A/100mA) Terminals: Finish Matte Tin Plated Leads, h characterized up to -10A for high current gain hold up Solderable per MIL-STD-202, Method 208 FE Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.015 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications DC - DC Converters Power Management Functions Power Switches Motor Control C SOT26 B E Top View Device Symbol Pin-Out Top Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP2006E6TA AEC-Q101 52 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXTP2006E6 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -25 V V CBO Collector-Emitter Voltage -20 V V CEO Emitter-Base Voltage -7.5 V V EBO Continuous Collector Current I -3.5 A C Peak Pulse Collector Current I -10 A CM Thermal Characteristics ( TA = +25C, unless otherwise specified.) Characteristic Symbol Value Unit 1.1 (Note 5) 8.8 Power Dissipation W P D Linear Derating Factor 1.7 mW/C (Note 6) 13.6 (Note 5) 113 Thermal Resistance, Junction to Ambient R JA (Note 6) 73 C/W Thermal Resistance, Junction to Lead (Note 7) R 18.61 JL Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with collector leads on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is measured at t 5secs. 7. Thermal resistance from junction to solder-point (at the end of the collector leads). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTP2006E6 October 2015 Diodes Incorporated www.diodes.com Document Number: DS33707 Rev: 2 - 2 ADVANCE INFORMATION