ZXTP 25020DG Green 20V PNP MEDIUM POWER HIGH GAIN TRANSISTOR IN SOT223 Features Mechanical Data BV > -20V Case: SOT223 CEO BV > -25V Case Material: Molded Plastic, Green Molding Compound. CBO I = -6A High Continuous Current UL Flammability Rating 94V-0 C h > 200 -1A and Low Saturation Voltage Moisture Sensitivity: Level 1 per J-STD-020 FE Extremely Low Equivalent On-Resistance R 42m Terminals: Finish - Matte Tin Plated Leads. CE(sat) Complementary NPN Type: ZXTN25020DG Solderable per MIL-STD-202, Method 208 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications Load Switch Motor Drive Regulator Circuit C SOT223 E C C B B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP25020DGTA AEC-Q101 ZXTP25020DG 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See ZXTP 25020DG Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -25 V CBO Collector-Emitter Voltage V -20 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -6 A C Peak Pulse Current -10 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3 (Note 6) 2 Power Dissipation P W D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 7) 78.1 C/W (Note 8) 104 Thermal Resistance Junction to Lead (Note 9) 12.9 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 6, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 6, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 6, except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTP25020DG November 2015 Diodes Incorporated www.diodes.com Document number: DS33751 Rev. 2 - 2