A Product Line of Diodes Incorporated ZXTP717MA 12V PNP LOW SATURATION SWITCHING TRANSISTOR Features and Benefits Mechanical Data Case: DFN2020B-3 BV > -12V CEO I = -4A Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound. C Low Saturation Voltage (-140mV max -1A) Terminals: Pre-Plated NiPdAu leadframe. R = 60 m for a low equivalent On-Resistance SAT Nominal Package Height: 0.6mm h specified up to -10A for a high current gain hold up UL Flammability Rating 94V-0 FE Low profile 0.6mm high package for thin applications Moisture Sensitivity: Level 1 per J-STD-020 R efficient, 60% lower than SOT23 JA Weight: 0.01 grams (approximate) 2 4mm footprint, 50% smaller than SOT23 Lead-Free, RoHS Compliant (Note 1) Halogen and Antimony Free.Gree Device (Note 2) Applications Qualified to AEC-Q101 Standards for High Reliability MOSFET Gate Driving DC-DC Converters Charging Circuits Power switches Motor Control DFN2020B-3 C B E Top View Bottom View Device Symbol Bottom View Pin-Out Ordering Information (Note 3) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP717MATA S1 7 8 3000 Notes: 1. No purposefully added lead. 2. Diodes Inc sGree policy can be found on our website at A Product Line of Diodes Incorporated ZXTP717MA Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Collector-Base Voltage V -20 CBO Collector-Emitter Voltage V -12 V CEO Emitter-Base Voltage V -7 EBO Peak Pulse Current I -12 CM (Note 4) -4 Continuous Collector Current I A C (Note 5) -4.5 Base Current I -1 B Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit 1.5 (Note 4) Power Dissipation 12 W P D Linear Derating Factor 2.45 mW/C (Note 5) 19.6 (Note 4) 83 Thermal Resistance, Junction to Ambient R JA (Note 5) 51 C/W Thermal Resistance, Junction to Lead (Note 6) R 16.8 JL Operating and Storage Temperature Range -55 to +150 C T T J, STG 2 Notes: 4. For a device surface mounted on 31mm x 31mm (10cm ) FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink. 5. Same as note (4), except the device is measured at t 5 sec. 6. For a single device, thermal resistance from junction to solder-point (at the end of the drain lead). ZXTP717MA 2 of 7 January 2011 Document Number DS31881 Rev. 5 - 2 Diodes Incorporated www.diodes.com