BSC046N10NS3 G TM OptiMOS 3 Power-Transistor Product Summary Features V 100 V DS Very low gate charge for high frequency applications R 4.6 mW DS(on),max Optimized for dc-dc conversion I 100 A D N-channel, normal level PG-TDSON-8 Excellent gate charge x R product (FOM) DS(on) Very low on-resistance R DS(on) 150 C operating temperature Pb-free lead plating RoHS compliant 1) Qualified according to JEDEC for target application Halogen-free according to IEC61249-2-21 Type Package Marking BSC046N10NS3 G PG-TDSON-8 046N10NS MMaaxximimuumm rraattininggss,, aatt TT ==2255 C,C, uunnlleessss ooththeerrwwiissee ssppeecciiffiieedd j Value Parameter Symbol Conditions Unit I T =25 C Continuous drain current 100 A D C T =100 C 85 C T =25 C, A 17.0 2) R =50 K/W thJA 3) I T =25 C 400 Pulsed drain current D,pulse C E I =50 A, R =25 W Avalanche energy, single pulse 350 mJ AS D GS Gate source voltage V 20 V GS P T =25 C Power dissipation 156 W tot C T , T Operating and storage temperature -55 ... 150 C j stg IEC climatic category DIN IEC 68-1 55/150/56 ReRevv.. 22.0.0 ppaaggee 11 22001111--0099--2299BSC046N10NS3 G Parameter Symbol Conditions Values Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R - - 0.8 K/W thJC R minimal footprint - - 62 thJA Thermal resistance, junction - ambient 2 2) - - 50 6 cm cooling area Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0 V, I =1 mA Drain-source breakdown voltage 100 - - V (BR)DSS GS D V V =V , I =120 A Gate threshold voltage 2 2.7 3.5 GS(th) DS GS D V =100 V, V =0 V, DS GS I Zero gate voltage drain current - 0.01 1 A DSS T =25 C j V =100 V, V =0 V, DS GS - 10 100 T =125 C j I V =20 V, V =0 V Gate-source leakage current - 1 100 nA GSS GS DS R V =10 V, I =50 A Drain-source on-state resistance - 4 4.6 mW DS(on) GS D V =6 V, I =25 A - 5.1 8.6 GS D R Gate resistance - 1.9 - W G V >2 I R , DS D DS(on)max g Transconductance 48 96 - S fs I =50 A D 1) J-STD20 and JESD22 2) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 3) see figure 3 ReRevv.. 22.0.0 ppaaggee 22 22001111--0099--2299