X-On Electronics has gained recognition as a prominent supplier of IPD096N08N3GATMA1 mosfet across the USA, India, Europe, Australia, and various other global locations. IPD096N08N3GATMA1 mosfet are a product manufactured by Infineon. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

IPD096N08N3GATMA1 Infineon

IPD096N08N3GATMA1 electronic component of Infineon
Images are for reference only
See Product Specifications
Part No.IPD096N08N3GATMA1
Manufacturer: Infineon
Category:MOSFET
Description: MOSFET TRENCH 40<-<100V
Datasheet: IPD096N08N3GATMA1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.311 ea
Line Total: USD 1.31

Availability - 1755
Ships to you between
Tue. 11 Jun to Thu. 13 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
56 - WHS 1


Ships to you between
Wed. 12 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 1.9335
10 : USD 1.6394
30 : USD 1.4782
100 : USD 1.2951
500 : USD 1.2145
1000 : USD 1.1781

1755 - WHS 2


Ships to you between Tue. 11 Jun to Thu. 13 Jun

MOQ : 1
Multiples : 1
1 : USD 1.311
10 : USD 1.0419
100 : USD 0.8499
500 : USD 0.7556
1000 : USD 0.6325
2500 : USD 0.6049
5000 : USD 0.6049
10000 : USD 0.5819
25000 : USD 0.5808

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Tradename
Configuration
Height
Length
Series
Transistor Type
Width
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Cnhts
Hts Code
Mxhts
Taric
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We are delighted to provide the IPD096N08N3GATMA1 from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IPD096N08N3GATMA1 and other electronic components in the MOSFET category and beyond.

IPD096N08N3 G (TM) OptiMOS 3 Power-Transistor Product Summary Features V 80 V DS Ideal for high frequency switching R 9.6 mW DS(on),max Optimized technology for DC/DC converters I 73 A D Excellent gate charge x R product (FOM) DS(on) N-channel, normal level 100% avalanche tested Pb-free plating RoHS compliant 1) Qualified according to JEDEC for target applications Halogen-free according to IEC61249-2-21 Type IPD096N08N3 G Package PG-TO252-3 Marking 096N08N Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit 2) Continuous drain current I 73 A T =25C D C T =100C 52 C 2) I T =25C 292 Pulsed drain current D,pulse C 3) E I =46A, R =25W 90 mJ Avalanche energy, single pulse AS D GS Gate source voltage V 20 V GS P T =25C Power dissipation 100 W tot C T , T Operating and storage temperature -55 ... 175 C j stg IEC climatic category DIN IEC 68-1 55/175/56 1) J-STD20 and JESD22 2) See figure 3 for more detailed information 3) See figure 13 for more detailed information Rev. 2.2 page 1 2014-05-19IPD096N08N3 G Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics R Thermal resistance, junction - case - - 1.5 K/W thJC Thermal resistance, R minimal footprint - - 75 thJA 2 4) junction - ambient - - 50 6 cm cooling area Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics Drain-source breakdown voltage V V =0V, I =1mA 80 - - V (BR)DSS GS D Gate threshold voltage V V =V , I =46A 2 2.8 3.5 GS(th) DS GS D V =80V, V =0V, DS GS Zero gate voltage drain current I - 0.1 1 A DSS T =25C j V =80V, V =0V, DS GS - 10 100 T =125C j Gate-source leakage current I V =20V, V =0V - 1 100 nA GSS GS DS R V =10V, I =46A Drain-source on-state resistance - 7.9 9.6 mW DS(on) GS D V =6V, I =23A - 10.5 17.8 GS D Gate resistance R - 1.6 - W G V >2 I R , DS D DS(on)max g Transconductance 30 60 - S fs I =46A D 4) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 2.2 page 2 2014-05-19

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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