Product Information

IXTY1R4N60P

IXTY1R4N60P electronic component of IXYS

Datasheet
N-Channel 600 V 1.4A (Tc) 50W (Tc) Surface Mount TO-252AA

Manufacturer: IXYS
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.2604 ea
Line Total: USD 0.26

19 - Global Stock
Ships to you between
Wed. 22 May to Tue. 28 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
19 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 0.2708

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Channel Mode
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
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TM IXTP 1R4N60P V = 600 V PolarHV DSS IXTU 1R4N60P I = 1.4 A Power MOSFET D25 IXTY 1R4N60P R 9.0 DS(on) N-Channel Enhancement Mode Avalanche Rated Symbol Test Conditions Maximum Ratings TO-220 (IXTP) V T = 25 C to 175 C 600 V DSS J V T = 25 C to 175 C R = 1 M 600 V DGR J GS V Continuous 30 V GS (TAB) G D V Transient 40 V GSM S I T = 25 C 1.4 A D25 C TO-251 (IXTU) I T = 25 C, pulse width limited by T 2.1 A DM C JM I T = 25 C 1.4 A AR C E T = 25C5mJ AR C E T = 25C75mJ AS C G dv/dt I I , di/dt 100 A/s, V V , 10 V/ns S DM DD DSS D T 150C, R = 20 J G S (TAB) P T = 25C50W D C T -55 ... +150 C J TO-252 (IXTY) T 150 C JM T -55 ... +150 C stg T 1.6 mm (0.062) from case for 10 s 300 C L G T Plastic body for 10 s 260 C SOLD S (TAB) Weight TO-220 4.0 g TO-252 0.35 g G = Gate D = Drain TO-251 0.4 g S = Source TAB = Drain Symbol Test Conditions Characteristic Values Features (T = 25 C, unless otherwise specified) Min. Typ. Max. J l BV V = 0 V, I = 25 A 600 V International standard packages DSS GS D l Unclamped Inductive Switching (UIS) V V = V , I = 25 A 3.0 5.5 V GS(th) DS GS D rated l Low package inductance I V = 30 V , V = 0 50 nA GSS GS DC DS - easy to drive and to protect I V = V 1 A DSS DS DSS V = 0 V T = 125C20 A GS J Advantages R V = 10 V, I = 0.5 I 9.0 DS(on) GS D D25 l Easy to mount Pulse test, t 300 s, duty cycle d 2 % l Space savings l High power density DS99253E(10/05) 2006 IXYS All rights reservedIXTP 1R4N60P IXTU 1R4N60P IXTY 1R4N60P Symbol Test Conditions Characteristic Values TO-220 (IXTP) Outline (T = 25 C, unless otherwise specified) J Min. Typ. Max. g V = 20 V I = 0.5 I , pulse test 0.7 1.1 S fs DS D D25 C 140 pF iss C V = 0 V, V = 25 V, f = 1 MHz 17 pF oss GS DS C 2.4 pF rss t 10 ns d(on) t V = 10 V, V = 0.5 V , I =0.5 I 16 ns r GS DS DSS D D25 t R = 50 (External) 25 ns d(off) G t 16 ns Pins: 1 - Gate 2,4 - Drain f 3 - Source Q 5.2 nC g(on) Q V = 10 V, V = 0.5 V , I = 0.5 I 1.34 nC gs GS DS DSS D D25 Q 5.2 nC gd R 2.5 C/W thJC R (TO-220) 0.25 C/W thCS R (TO-251) 1.0 C/W thCS Source-Drain Diode Characteristic Values (T = 25 C, unless otherwise specified) J Symbol Test Conditions Min. Typ. Max. I V = 0 V 1.4 A S GS I Repetitive 4 A SM TO-252 AA (IXTY) Outline V I = I , V = 0 V, 1.5 V SD F S GS Pulse test, t 300 s, duty cycle d 2 % t I = 1.5 A, -di/dt =100 A/s 500 ns rr F V =100 V, V = 0 V R GS TO-251 (IXTU) Outline Dim. Millimeter Inches Dim. Millimeter Inches Min. Max. Min. Max. Min. Max. Min. Max. A 2.19 2.38 .086 .094 A 2.19 2.38 0.086 0.094 A1 0.89 1.14 0.35 .045 A1 0.89 1.14 0.035 0.045 b 0.64 0.89 .025 .035 A2 0 0.13 0 0.005 b1 0.76 1.14 .030 .045 b 0.64 0.89 0.025 0.035 b2 5.21 5.46 .205 .215 b1 0.76 1.14 0.030 0.045 c 0.46 0.58 .018 .023 b2 5.21 5.46 0.205 0.215 c1 0.46 0.58 .018 .023 c 0.46 0.58 0.018 0.023 D 5.97 6.22 .235 .245 c1 0.46 0.58 0.018 0.023 E 6.35 6.73 .250 .265 D 5.97 6.22 0.235 0.245 e 2.28 BSC .090 BSC D1 4.32 5.21 0.170 0.205 e1 4.57 BSC .180 BSC E 6.35 6.73 0.250 0.265 H 17.02 17.78 .670 .700 E1 4.32 5.21 0.170 0.205 L 8.89 9.65 .350 .380 e 2.28 BSC 0.090 BSC L1 1.91 2.28 .075 .090 e1 4.57 BSC 0.180 BSC 1. Gate L2 0.89 1.27 .035 .050 2. Drain H 9.40 10.42 0.370 0.410 3. Source L 0.51 1.02 0.020 0.040 4. Drain L1 0.64 1.02 0.025 0.040 L2 0.89 1.27 0.035 0.050 L3 2.54 2.92 0.100 0.115 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
CLR
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR

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