Product Information

NTD4809NT4G

NTD4809NT4G electronic component of ON Semiconductor

Datasheet
MOSFET NFET 30V 58A 9MOHM

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.6981 ea
Line Total: USD 0.7

3 - Global Stock
Ships to you between
Tue. 28 May to Fri. 31 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3 - WHS 1


Ships to you between
Tue. 28 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

NTD4809NT4G
ON Semiconductor

1 : USD 0.6548
10 : USD 0.5338
30 : USD 0.4816
100 : USD 0.417
500 : USD 0.3888
1000 : USD 0.3707

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Channel Mode
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Height
Length
Transistor Type
Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
Category
Brand Category
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NTD4809N, NVD4809N MOSFET Power, Single, N-Channel, DPAK/IPAK 30 V, 58 A Features NTD4809N, NVD4809N THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 2.9 C/W JC JunctiontoTAB (Drain) R 3.5 JC TAB JunctiontoAmbient Steady State (Note 1) R 57.1 JA JunctiontoAmbient Steady State (Note 2) R 107.2 JA 1. Surfacemounted on FR4 board using 1 in sq pad size, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 25 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 24 V DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 250 A 1.5 2.5 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 5.7 mV/C GS(TH) J DraintoSource On Resistance R V = 10 to I = 30 A 7.0 9.0 m DS(on) GS D 11.5 V I = 15 A 7.0 D V = 4.5 V I = 30 A 12 14 GS D I = 15 A 11 D Forward Transconductance gFS V = 15 V, I = 15 A 9.0 S DS D CHARGES AND CAPACITANCES Input Capacitance C 1456 pF iss V = 0 V, f = 1.0 MHz, GS Output Capacitance C 315 oss V = 12 V DS Reverse Transfer Capacitance C 200 rss Total Gate Charge Q 11 13 nC G(TOT) Threshold Gate Charge Q 2.5 G(TH) V = 4.5 V, V = 15 V, GS DS I = 30 A D GatetoSource Charge Q 4.8 GS GatetoDrain Charge Q 5.0 GD Total Gate Charge Q V = 11.5 V, V = 15 V, 25 nC G(TOT) GS DS I = 30 A D SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 12.3 ns d(on) Rise Time t 21.3 r V = 4.5 V, V = 15 V, GS DS I = 15 A, R = 3.0 D G TurnOff Delay Time t 15.1 d(off) Fall Time t 5.3 f Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 4. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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