Product Information

NTHL020N120SC1

NTHL020N120SC1 electronic component of ON Semiconductor

Datasheet
1.2kV 103A 20mO@20V,60A 535W N Channel TO-247-3 MOSFETs ROHS

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 45.5727 ea
Line Total: USD 45.57

511 - Global Stock
Ships to you between
Wed. 29 May to Fri. 31 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
881 - WHS 1


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

NTHL020N120SC1
ON Semiconductor

1 : USD 33.4002
10 : USD 33.1866
25 : USD 30.4576
50 : USD 30.3509
100 : USD 29.4254
250 : USD 29.4254
450 : USD 29.4254

     
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Hts Code
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MOSFET - SiC Power, Single N-Channel 1200 V, 20 m , 103 A NTHL020N120SC1 Features Typ. R = 20 m DS(on) www.onsemi.com Ultra Low Gate Charge (Q = 203 nC) G(tot) Capacitance (C = 260 pF) oss V R MAX I MAX 100% UIL Tested (BR)DSS DS(on) D These Devices are RoHS Compliant 1200 V 28 m 20 V 103 A Typical Applications UPS NCHANNEL MOSFET DC/DC Converter D Boost Inverter MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit G DraintoSource Voltage V 1200 V DSS GatetoSource Voltage V 15/+25 V GS Recommended Opera- T < 175C V 5/+20 V C GSop S tion Values of Gateto Source Voltage Continuous Drain Steady T = 25C I 103 A C D Current R State JC Power Dissipation R P 535 W JC D Continuous Drain Steady T = 100C I 73 A C D G Current R State JC D S Power Dissipation R P 267 W TO2473LD JC D CASE 340CX Pulsed Drain Current T = 25C I 412 A A DM (Note 2) MARKING DIAGRAM Operating Junction and Storage Temperature T , T 55 to C J stg Range +175 Source Current (Body Diode) I 54 A S Single Pulse DraintoSource Avalanche E 264 mJ AS Energy (I = 23 A, L = 1 mH) (Note 3) L(pk) Y&Z&3&K NTHL020 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be N120SC1 assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Note 1) R 0.28 C/W JC Y = ON Semiconductor Logo &Z = Assembly Plant Code JunctiontoAmbient (Note 1) R 40 C/W JA &3 = Data Code (Year & Week) 1. The entire application environment impacts the thermal resistance values shown, &K = Lot they are not constants and are only valid for the particular conditions noted. NTHL020N120SC1 = Specific Device Code 2. Repetitive rating, limited by max junction temperature. 3. E of 264 mJ is based on starting T = 25C L = 1 mH, I = 23 A, V = AS J AS DD 120 V, V = 18 V. GS ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: April, 2021 Rev. 1 NTHL020N120SC1/DNTHL020N120SC1 ELECTRICAL CHARACTERISTICS Parameter Symbol Test Conditions Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V =0V, I = 1 mA 1200 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 900 I = 1 mA, referenced to 25 C mV/ C (BR)DSS J D Temperature Coefficient Zero Gate Voltage Drain Current I V =0V, V = 1200 V, T =25 C 100 A DSS GS DS J V =0V, V = 1200 V, T = 175 C 250 GS DS J GatetoSource Leakage Current I V = +25/15 V, V =0V 1 A GSS GS DS ON CHARACTERISTICS Gate Threshold Voltage V V =V , I = 20 mA 1.8 2.7 4.3 V GS(th) GS DS D Recommended Gate Voltage V 5 +20 V GOP DraintoSource On Resistance R 20 28 m V =20V, I = 60 A, T =25 C DS(on) GS D J V =20V, I = 60 A, T = 175 C 35 50 GS D J Forward Transconductance g V =10V, I =60A 28 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C V = 0 V, f = 1 MHz, V = 800 V 2890 pF GS DS ISS Output Capacitance C 260 OSS Reverse Transfer Capacitance C 22 RSS Total Gate Charge Q V = 5/20 V, V = 600 V, I =80A 203 nC GS DS D G(tot) Threshold Gate Charge Q 33 G(th) GatetoSource Charge Q 66 GS GatetoDrain Charge Q 47 GD Gate Resistance R f = 1 MHz 1.81 G SWITCHING CHARACTERISTICS Turn-On Delay Time t V = 5/20 V, V = 800 V, 25 ns d(on) GS DS I = 80 A, R =2 , D G Rise Time t 57 r Inductive Load TurnOff Delay Time t 45 d(off) Fall Time t 11 f Turn-On Switching Loss E 2718 J ON Turn-Off Switching Loss E 326 OFF Total Switching Loss E 3040 TOT DRAINSOURCE DIODE CHARACTERISTICS Continuous DraintoSource Diode I V = 5V, T =25 C 54 A SD GS J Forward Current Pulsed DraintoSource Diode For- I V = 5V, T =25 C 412 A SDM GS J ward Current (Note 2) Forward Diode Voltage V V = 5V, I = 30 A, T =25 C 3.7 V SD GS SD J Reverse Recovery Time t V = 5/20 V, I =80A, 31 ns RR GS SD dI /dt = 1000 A/ s S Reverse Recovery Charge Q 240 nC RR Reverse Recovery Energy E 10 J REC Peak Reverse Recovery Current I 15 A RRM Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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