Product Information

NTTFS4C06NTAG

NTTFS4C06NTAG electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET Pwr MOSFET 30V 65A 4.2mOhm SGL N-CH

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.2879 ea
Line Total: USD 2.29

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 13 May to Fri. 17 May

MOQ : 1500
Multiples : 1500

Stock Image

NTTFS4C06NTAG
ON Semiconductor

1500 : USD 0.4089

0 - WHS 2


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 1
Multiples : 1

Stock Image

NTTFS4C06NTAG
ON Semiconductor

1 : USD 2.2879
10 : USD 0.8259
100 : USD 0.5491
500 : USD 0.4596
1000 : USD 0.3909

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Series
Transistor Type
Brand
Factory Pack Quantity :
Configuration
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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NTTFS4C06N MOSFET Power, Single, N-Channel, 8FL 30 V, 67 A Features NTTFS4C06N 2. Surfacemounted on FR4 board using the minimum recommended pad size. 3. This is the absolute maximum ratings. Parts are 100% tested at T = 25C, J V = 10 V, I = 20 A, E = 20 mJ. GS L AS THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 4.1 JC JunctiontoAmbient Steady State (Note 4) R 58 JA C/W JunctiontoAmbient Steady State (Note 5) 154.3 R JA JunctiontoAmbient (t 10 s) (Note 4) R 28.3 JA 4. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 5. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V V = 0 V, I = 12.6 A, 34 (BR)DSSt GS D(aval) V (transient) T = 25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 14.4 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 6) Gate Threshold Voltage V V = V , I = 250 A 1.3 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 3.8 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 3.4 4.2 DS(on) GS D m V = 4.5 V I = 30 A 4.9 6.1 GS D Forward Transconductance g V = 1.5 V, I = 15 A 58 S FS DS D Gate Resistance R T = 25C 1.0 G A CHARGES AND CAPACITANCES Input Capacitance C 1683 3366 ISS Output Capacitance C 841 1682 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 40 RSS Capacitance Ratio C /C V = 0 V, V = 15 V, f = 1 MHz 0.023 RSS ISS GS DS Total Gate Charge Q 11.6 16.2 G(TOT) Threshold Gate Charge Q 2.6 3.6 G(TH) nC GatetoSource Charge Q 4.7 6.6 V = 4.5 V, V = 15 V I = 30 A GS GS DS D GatetoDrain Charge Q 4.0 5.6 GD Gate Plateau Voltage V 3.1 V GP Total Gate Charge Q V = 10 V, V = 15 V I = 30 A 26 36 nC G(TOT) GS DS D Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 6. Pulse Test: pulse width 300 s, duty cycle 2%. 7. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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