Product Information

NVTFS6H850NTAG

NVTFS6H850NTAG electronic component of ON Semiconductor

Datasheet
MOSFET TRENCH 8 80V NFET

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 1.2797 ea
Line Total: USD 1.28

1455 - Global Stock
Ships to you between
Tue. 21 May to Mon. 27 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1416 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

NVTFS6H850NTAG
ON Semiconductor

1 : USD 0.6514
10 : USD 0.6443
25 : USD 0.5914
100 : USD 0.4968
250 : USD 0.4869
500 : USD 0.4869
1000 : USD 0.4869

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Configuration
Series
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Cnhts
Hts Code
Mxhts
Taric
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MOSFET Power, Single N-Channel 80 V, 9.5 m , 68 A NVTFS6H850N Features Small Footprint (3.3 x 3.3 mm) for Compact Design www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses NVTFS6H850NWF Wettable Flanks Product V R MAX I MAX (BR)DSS DS(on) D AECQ101 Qualified and PPAP Capable 80 V 68 A 9.5 m 10 V These Devices are PbFree and are RoHS Compliant MAXIMUM RATINGS (T = 25C unless otherwise noted) J NChannel Parameter Symbol Value Unit D (5 8) DraintoSource Voltage V 80 V DSS GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 68 A C D G (4) Current R JC T = 100C 48 (Notes 1, 2, 3, 4) C Steady State Power Dissipation T = 25C P 107 W S (1, 2, 3) C D R (Notes 1, 2, 3) JC T = 100C 53 C MARKING DIAGRAM Continuous Drain T = 25C I 11 A A D Current R 1 JA T = 100C 8.4 (Notes 1 & 3, 4) 1 A S D Steady XXXX State WDFN8 S D Power Dissipation T = 25C P 3.2 W A D AYWW S D ( 8FL) R (Notes 1, 3) JA T = 100C 1.6 G D A CASE 511AB Pulsed Drain Current T = 25C, t = 10 s I 300 A A p DM XXXX = Specific Device Code Operating Junction and Storage Temperature T , T 55 to C J stg A = Assembly Location +175 Y = Year WW = Work Week Source Current (Body Diode) I 89 A S = PbFree Package Single Pulse DraintoSource Avalanche E 271 mJ AS Energy (I = 3.4 A) (Note: Microdot may be in either location) L(pk) Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be See detailed ordering, marking and shipping information in the assumed, damage may occur and reliability may be affected. package dimensions section on page 5 of this data sheet. THERMAL RESISTANCE MAXIMUM RATINGS (Note 1) Parameter Symbol Value Unit JunctiontoCase Steady State (Note 3) R 1.4 C/W JC JunctiontoAmbient Steady State (Note 3) R 47 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Psi ( ) is used as required per JESD51 12 for packages in which substantially less than 100% of the heat flows to single case surface. 2 3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 4. Continuous DC current rating. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: December, 2019 Rev. 2 NVTFS6H850N/DNVTFS6H850N ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 80 V (BR)DSS GS D Zero Gate Voltage Drain Current I T = 25C 10 A DSS J V = 0 V, GS V = 80 V DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 70 A 2.0 4.0 V GS(TH) GS DS D DraintoSource On Resistance R V = 10 V, I = 10 A 8.5 9.5 m DS(on) GS D Forward Transconductance g V = 15 V, I = 10 A 63 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 1140 pF iss V = 0 V, f = 1.0 MHz, GS Output Capacitance C 175 oss V = 40 V DS Reverse Transfer Capacitance C 10 rss Threshold Gate Charge Q 3.6 nC G(TH) GatetoSource Charge Q 6.5 GS V = 10 V, V = 40 V, I = 10 A GS DS D GatetoDrain Charge Q 3.7 GD Total Gate Charge Q V = 10 V, V = 40 V, I = 10 A 19 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 6) TurnOn Delay Time t 11 ns d(on) Rise Time t 32 r V = 6.0 V, V = 64 V, GS DS I = 10 A D TurnOff Delay Time t 34 d(off) Fall Time t 8.0 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.8 1.2 V SD J V = 0 V, GS I = 10 A S T = 125C 0.7 J Reverse Recovery Time t 40 ns RR Charge Time t 24 a V = 0 V, dl /dt = 100 A/ s, GS S I = 10 A S Discharge Time t 16 b Reverse Recovery Charge Q 40 nC RR 5. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 6. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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