W29N01HZBINA Winbond

W29N01HZBINA electronic component of Winbond
W29N01HZBINA Winbond
W29N01HZBINA NAND Flash
W29N01HZBINA Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W29N01HZBINA NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N01HZBINA NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

Part No. W29N01HZBINA
Manufacturer: Winbond
Category: NAND Flash
Description: NAND Flash 1G-bit NAND flash 1.8V 1-bit ECC x8
Datasheet: W29N01HZBINA Datasheet (PDF)
Price (USD)
1: USD 4.875 ea
Line Total: USD 4.88 
Availability - 203
  
Ship by Fri. 25 Jul to Tue. 29 Jul
QtyUnit Price
1$ 4.875
10$ 3.828
25$ 3.729
50$ 3.498
100$ 3.41
210$ 3.168
420$ 3.124
1050$ 3.058

 W29N01HZBINA More Buying Options & Price Grid(s)
Availability 87
Ship by Tue. 29 Jul to Mon. 04 Aug
MOQ : 40
Multiples : 1
QtyUnit Price
40$ 6.6157
50$ 5.2715
55$ 4.7827
60$ 4.3927

Availability 203
Ship by Fri. 25 Jul to Tue. 29 Jul
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 4.875
10$ 3.828
25$ 3.729
50$ 3.498
100$ 3.41
210$ 3.168
420$ 3.124
1050$ 3.058

Specifications

   
Manufacturer
Product Category
Mounting Style
Package / Case
Series
Memory Size
Interface Type
Organisation
Timing Type
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W29N01HZBINA from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N01HZBINA and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N01HZ/W W29N01HZ/W 1G-BIT 1.8V NAND FLASH MEMORY th Release Date: January, 11 , 2018 1 Revision C W29N01HZ/W Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pin assignment 48 pin TSOP1 (x8) ...................................................................................... 7 3.2 Pin assignment 48 ball VFBGA (x8) ..................................................................................... 8 3.3 Pin assignment 48 ball VFBGA (x16) ................................................................................... 9 3.4 Pin assignment 63 ball VFBGA (x8) ................................................................................... 10 3.5 Pin assignment 63 ball VFBGA (x16) ................................................................................. 11 3.6 Pin Descriptions .................................................................................................................. 12 4. PIN DESCRITPIONS ...................................................................................................................... 13 4.1 Chip Enable ( CE) .............................................................................................................. 13 4.2 Write Enable ( WE) ............................................................................................................ 13 4.3 Read Enable ( RE) ............................................................................................................ 13 4.4 Address Latch Enable (ALE) .............................................................................................. 13 4.5 Command Latch Enable (CLE) .......................................................................................... 13 4.6 Write Protect ( WP) ............................................................................................................ 13 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 13 4.8 Input and Output (I/Ox) ....................................................................................................... 13 5. BLOCK DIAGRAM .......................................................................................................................... 14 6. MEMORY ARRAY ORGANIZATION .............................................................................................. 15 6.1 Array Organization (x8) ...................................................................................................... 15 6.2 Array Organization (x16) .................................................................................................... 16 7. MODE SELECTION TABLE ........................................................................................................... 17 8. COMMAND TABLE......................................................................................................................... 18 9. DEVICE OPERATIONS .................................................................................................................. 19 9.1 READ operation .................................................................................................................. 19 9.1.1 PAGE READ (00h-30h)......................................................................................................... 19 9.1.2 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 20 9.1.3 READ ID (90h) ...................................................................................................................... 20 9.1.4 READ PARAMETER PAGE (ECh) ....................................................................................... 21 9.1.5 READ STATUS (70h)............................................................................................................ 23 9.2 PROGRAM operation ......................................................................................................... 25 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 25 9.2.2 SERIAL DATA INPUT (80h) .................................................................................................. 25 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 26 9.3 COPY BACK operation....................................................................................................... 27 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 27 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 27 9.4 BLOCK ERASE operation .................................................................................................. 29 9.4.1 BLOCK ERASE (60h-D0h) .................................................................................................... 29 9.5 RESET operation ................................................................................................................ 30 9.5.1 RESET (FFh) ........................................................................................................................ 30 9.6 WRITE PROTECT .............................................................................................................. 31 th Release Date: January, 11 , 2018 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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