X-On Electronics has gained recognition as a prominent supplier of ZXMHC6A07N8TC MOSFET across the USA, India, Europe, Australia, and various other global locations. ZXMHC6A07N8TC MOSFET are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

ZXMHC6A07N8TC Diodes Incorporated

ZXMHC6A07N8TC electronic component of Diodes Incorporated
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See Product Specifications
Part No.ZXMHC6A07N8TC
Manufacturer: Diodes Incorporated
Category: MOSFET
Description: Mosfet Array 2 N and 2 P-Channel (Half Bridge) 60V 1.39A, 1.28A 870mW Surface Mount 8-SO
Datasheet: ZXMHC6A07N8TC Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.9775 ea
Line Total: USD 0.98

Availability - 82299
Ships to you between
Fri. 28 Jun to Tue. 02 Jul
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2425 - WHS 1


Ships to you between Mon. 24 Jun to Fri. 28 Jun

MOQ : 2500
Multiples : 2500
2500 : USD 0.4745
5000 : USD 0.4745

1928 - WHS 2


Ships to you between
Mon. 01 Jul to Thu. 04 Jul

MOQ : 1
Multiples : 1
1 : USD 1.0037
10 : USD 0.8177
30 : USD 0.7237
100 : USD 0.6317
500 : USD 0.5771
1000 : USD 0.5491

82299 - WHS 3


Ships to you between Fri. 28 Jun to Tue. 02 Jul

MOQ : 1
Multiples : 1
1 : USD 0.9775
10 : USD 0.8257
100 : USD 0.6716
500 : USD 0.6049
1000 : USD 0.5279
2500 : USD 0.4784
5000 : USD 0.4566
10000 : USD 0.4531
25000 : USD 0.4416

7273 - WHS 4


Ships to you between Mon. 24 Jun to Fri. 28 Jun

MOQ : 14
Multiples : 1
14 : USD 0.6441
25 : USD 0.6378
100 : USD 0.5853
250 : USD 0.5794
500 : USD 0.5528
1000 : USD 0.5517
3000 : USD 0.5507
6000 : USD 0.5496

16975 - WHS 5


Ships to you between Mon. 24 Jun to Fri. 28 Jun

MOQ : 2500
Multiples : 2500
2500 : USD 0.6601

320100 - WHS 6


Ships to you between Mon. 24 Jun to Fri. 28 Jun

MOQ : 2500
Multiples : 2500
2500 : USD 0.5119

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Power Dissipation
Fall Time
Gate Charge Qg
Rise Time
Typical Turn-Off Delay Time
Series
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
Typical Turn-On Delay Time
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We are delighted to provide the ZXMHC6A07N8TC from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZXMHC6A07N8TC and other electronic components in the MOSFET category and beyond.

A Product Line of Diodes Incorporated ZXMHC6A07N8 60V SO8 Complementary enhancement mode MOSFET H-Bridge Summary I D Device V Q R (BR)DSS G DS(on) T = 25 C A 0.25 V = 10V 1.8A GS N-CH 60V 3.2nC 0.35 V = 4.5V 1.5A GS 0.40 V = -10V -1.4A GS P-CH -60V 5.1nC 0.60 V = -4.5V -1.2A GS P1S/P2S Description This new generation complementary MOSFET H-Bridge features low on-resistance achievable with low gate drive. P1G P2G Features P1D/N1D P2D/N2D 2 x N + 2 x P channels in a SOIC package Applications N1G N2G DC Motor control DC-AC Inverters N1S/N2S Ordering information Device Reel size Tape width Quantity (inches) (mm) per reel ZXMHC6A07N8TC 13 12 2,500 Device marking ZXMHC 6A07 Issue 1.0 - March 2009 1 www.diodes.com Diodes Incorporated ZXMHC6A07N8 Absolute maximum ratings Parameter Symbol N- P- Unit channel channel V Drain-Source voltage DSS 60 -60 V V Gate-Source voltage GS V 20 20 (b) 1.80 -1.42 A I D Continuous Drain current V = 10V T =25 C GS A (b) 1.40 -1.28 V = 10V T =70 C GS A (a) 1.39 -1.28 V = 10V T =25 C GS A (f) 1.42 -1.33 V = 10V T =25 C GS L (c) I DM 7.10 -6.03 A Pulsed Drain current V = 10V T =25 C GS A (b) 1.00 -1.00 A Continuous Source current (Body diode) at T =25 C I A S (c) 7.10 -6.03 A Pulsed Source current (Body diode) at T =25 C I A SM (a) 0.87 W Power dissipation at T =25 C P A D Linear derating factor 6.94 mW/ C (b) 1.36 W Power dissipation at T =25 C P A D Linear derating factor 10.9 mW/ C (f) 0.90 W Power dissipation at T =25 C L P D mW/ C Linear derating factor 7.19 Operating and storage temperature range T , T -55 to 150 j stg C Thermal resistance Parameter Symbol Value Unit (a) R 144 Junction to ambient C/W JA (b) R 92 C/W Junction to ambient JA (d) R 106 Junction to ambient C/W JA (e) 254 R C/W Junction to ambient JA (f) R 139 C/W Junction to lead JL NOTES: (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions with the heat-sink split into two equal areas (one for each drain connection) the device is measured when operating in a steady-state condition with one active die. (b) Same as note (a), except the device is measured at t 10 sec. (c) Same as note (a), except the device is pulsed with D= 0.02 and pulse width 300 s. The pulse current is limited by the maximum junction temperature. (d) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions with the heat-sink split into two equal areas (one for each drain connection) the device is measured when operating in a steady-state condition with one active die. (e) For a device surface mounted on minimum copper 1.6mm FR4 PCB, in still air conditions the device is measured when operating in a steady-state condition with one active die. (f) Thermal resistance from junction to solder-point (at the end of the drain lead) the device is operating in a steady-state condition with one active die. Issue 1.0 - March 2009 2 www.diodes.com Diodes Incorporated

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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