IRFB5620PBF Infineon

IRFB5620PBF electronic component of Infineon
IRFB5620PBF Infineon
IRFB5620PBF MOSFETs
IRFB5620PBF  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of IRFB5620PBF MOSFETs across the USA, India, Europe, Australia, and various other global locations. IRFB5620PBF MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

Part No. IRFB5620PBF
Manufacturer: Infineon
Category: MOSFETs
Description: Transistor: N-MOSFET; unipolar; 200V; 25A; 144W; TO220AB
Datasheet: IRFB5620PBF Datasheet (PDF)
Price (USD)
1: USD 1.875 ea
Line Total: USD 1.88 
Availability : 1793
  
Ship by Mon. 11 Aug to Wed. 13 Aug
QtyUnit Price
1$ 1.875
10$ 0.9648
100$ 0.8789
1000$ 0.8778
2000$ 0.8382
25000$ 0.8371

Availability 1793
Ship by Mon. 11 Aug to Wed. 13 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.875
10$ 0.9648
100$ 0.8789
1000$ 0.8778
2000$ 0.8382
25000$ 0.8371


Availability 32
Ship by Mon. 11 Aug to Wed. 13 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.632
9$ 2.114
25$ 2.002


Availability 4854
Ship by Wed. 20 Aug to Mon. 25 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.583
10$ 1.5907
50$ 1.2618
100$ 1.0678
500$ 0.9819
1000$ 0.9427

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the IRFB5620PBF from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRFB5620PBF and other electronic components in the MOSFETs category and beyond.

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IRFB5620PbF Features Key Parameters Key Parameters Optimized for Class-D Audio V 200 V DS Amplifier Applications m R typ. 10V 60 DS(ON) Low R for Improved Efficiency Q typ. DSON 25 nC g Low Q and Q for Better THD and Improved Q typ. 9.8 nC G SW sw R typ. 2.6 Efficiency G(int) T max 175 C J Low Q for Better THD and Lower EMI RR 175C Operating Junction Temperature for D D Ruggedness Can Deliver up to 300W per Channel into 8 Load in Half-Bridge Configuration Amplifier G S D G S TO-220AB GD S Gate Drain Source Description This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD and EMI. Additional features of this MOSFET are 175C operating junction temperature and repetitive avalanche capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for ClassD audio amplifier applications. Absolute Maximum Ratings Parameter Max. Units V Drain-to-Source Voltage 200 DS V V Gate-to-Source Voltage 20 GS I T = 25C Continuous Drain Current, V 10V 25 D C GS I T = 100C Continuous Drain Current, V 10V 18 A D C GS Pulsed Drain Current I 100 DM Power Dissipation P T = 25C 144 D C W Power Dissipation P T = 100C 72 D C Linear Derating Factor 0.96 W/C T Operating Junction and -55 to + 175 J T Storage Temperature Range STG C Soldering Temperature, for 10 seconds 300 (1.6mm from case) 10lb in (1.1N m) Mounting torque, 6-32 or M3 screw Thermal Resistance Parameter Typ. Max. Units Junction-to-Case R 1.045 JC R Case-to-Sink, Flat, Greased Surface 0.50 C/W CS Junction-to-Ambient R 62 JA Notes through are on page 2 www.irf.com 1 09/05/08 Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions BV Drain-to-Source Breakdown Voltage 200 V V = 0V, I = 250A DSS GS D V /T Breakdown Voltage Temp. Coefficient 0.22 V/C Reference to 25C, I = 1mA DSS J D m R Static Drain-to-Source On-Resistance 60 72.5 V = 10V, I = 15A DS(on) GS D V Gate Threshold Voltage 3.0 5.0 V V = V , I = 100A GS(th) DS GS D V /T Gate Threshold Voltage Coefficient -14 mV/C GS(th) J I Drain-to-Source Leakage Current 20 V = 200V, V = 0V DSS DS GS A 250 V = 200V, V = 0V, T = 125C DS GS J I Gate-to-Source Forward Leakage 100 V = 20V GSS GS nA Gate-to-Source Reverse Leakage -100 V = -20V GS g Forward Transconductance 37 S V = 50V, I = 15A fs DS D Q Total Gate Charge 25 38 g Q Pre-Vth Gate-to-Source Charge 6.3 V = 100V gs1 DS Q Post-Vth Gate-to-Source Charge 1.9 V = 10V gs2 GS nC Q Gate-to-Drain Charge 7.9 I = 15A gd D Q Gate Charge Overdrive 9.3 See Fig. 6 and 19 godr Q Switch Charge (Q + Q ) 9.8 sw gs2 gd R Internal Gate Resistance 2.6 5.0 G(int) t Turn-On Delay Time 8.6 V = 100V, V = 10V d(on) DD GS t Rise Time 14.6 I = 15A r D ns t Turn-Off Delay Time 17.1 R = 2.4 d(off) G t Fall Time 9.9 f C Input Capacitance 1710 V = 0V iss GS C Output Capacitance 125 V = 50V oss DS pF C Reverse Transfer Capacitance 30 = 1.0MHz, See Fig.5 rss C Effective Output Capacitance 138 V = 0V, V = 0V to 160V oss GS DS L Internal Drain Inductance Between lead, D D 4.5 6mm (0.25in.) nH G L Internal Source Inductance from package S 7.5 S and center of die contact Avalanche Characteristics Parameter Typ. Max. Units Single Pulse Avalanche Energy E 113 mJ AS Avalanche Current I See Fig. 14, 15, 17a, 17b A AR Repetitive Avalanche Energy E mJ AR Diode Characteristics Parameter Min. Typ. Max. Units Conditions I T = 25C Continuous Source Current MOSFET symbol S C 25 (Body Diode) showing the A I Pulsed Source Current integral reverse SM 100 (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 15A, V = 0V SD J S GS t Reverse Recovery Time 98 147 ns T = 25C, I = 15A , V = 160V rr J F R Q Reverse Recovery Charge 491 737 nC di/dt = 100A/s rr Repetitive rating pulse width limited by max. junction temperature. R is measured at T of approximately 90C. J Starting T = 25C, L = 1.00mH, R = 25, I = 15A. Limited by Tjmax. See Figs. 14, 15, 17a, 17b for repetitive J G AS Pulse width 400s duty cycle 2%. avalanche information 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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