Product Information

NTTFS4930NTAG

NTTFS4930NTAG electronic component of ON Semiconductor

Datasheet
MOSFET NFET U8FL 30V 23A 23MOHM

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.7708 ea
Line Total: USD 0.77

928 - Global Stock
Ships to you between
Fri. 10 May to Tue. 14 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
685 - Warehouse 1


Ships to you between Fri. 10 May to Tue. 14 May

MOQ : 1
Multiples : 1

Stock Image

NTTFS4930NTAG
ON Semiconductor

1 : USD 0.5543
10 : USD 0.4807
100 : USD 0.4232
1000 : USD 0.2875
1500 : USD 0.2633
3000 : USD 0.2473
9000 : USD 0.2427
24000 : USD 0.2335

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Qg - Gate Charge
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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NTTFS4930N MOSFET Power, Single, N-Channel, 8FL 30 V, 23 A Features NTTFS4930N 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit C/W JunctiontoCase (Drain) R 6.2 JC JunctiontoAmbient Steady State (Note 3) R 60.7 JA JunctiontoAmbient Steady State (Note 4) R 159 JA JunctiontoAmbient (t 10 s) (Note 3) R 34.6 JA 3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2 4. Surfacemounted on FR4 board using the minimum recommended pad size (40 mm , 1 oz. Cu). ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 16 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 24 V DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V 1.2 1.6 2.2 V V = V , I = 250 A GS(TH) GS DS D Negative Threshold Temperature V /T 3.7 mV/C GS(TH) J Coefficient DraintoSource On Resistance R I = 7 A 15 23 m DS(on) D V = 10 V GS I = 10 A 15 D I = 6 A 22.7 30 D V = 4.5 V GS I = 10 A 22.7 D Forward Transconductance g V = 1.5 V, I = 15 A 19 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 476 pF iss Output Capacitance C 197 V = 0 V, f = 1.0 MHz, V = 15 V oss GS DS Reverse Transfer Capacitance C 101 rss Total Gate Charge Q 5.6 nC G(TOT) Threshold Gate Charge Q 0.5 G(TH) V = 4.5 V, V = 15 V, I = 20 A GS DS D GatetoSource Charge Q 1.5 GS GatetoDrain Charge Q 2.5 GD Total Gate Charge Q V = 10 V, V = 15 V, I = 20 A 10.3 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 6) TurnOn Delay Time t 8.4 ns d(on) Rise Time t 26.6 r V = 4.5 V, V = 15 V, GS DS I = 15 A, R = 3.0 D G TurnOff Delay Time t 10.4 d(off) Fall Time t 3.6 f 5. Pulse Test: pulse width = 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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