X-On Electronics has gained recognition as a prominent supplier of C2M0045170P MOSFETs across the USA, India, Europe, Australia, and various other global locations. C2M0045170P MOSFETs are a product manufactured by Wolfspeed. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

C2M0045170P Wolfspeed

C2M0045170P electronic component of Wolfspeed
C2M0045170P Wolfspeed
C2M0045170P MOSFETs
C2M0045170P  Semiconductors

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See Product Specifications
Part No. C2M0045170P
Manufacturer: Wolfspeed
Category: MOSFETs
Description: MOSFET DMOSFET 1.7kV 45mOHMS 4PLUS
Datasheet: C2M0045170P Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 109.824 ea
Line Total: USD 109.82 
Availability - 1054
Ship by Wed. 21 May to Fri. 23 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1054
Ship by Wed. 21 May to Fri. 23 May
MOQ : 1
Multiples : 1
1 : USD 109.824
10 : USD 102.96
30 : USD 98.989
60 : USD 98.967
120 : USD 98.945
270 : USD 96.657
510 : USD 96.58
1020 : USD 96.547
2520 : USD 96.536

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Forward Transconductance - Min
Cnhts
Fall Time
Hts Code
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the C2M0045170P from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the C2M0045170P and other electronic components in the MOSFETs category and beyond.

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V 1700 V DS I 25C 72 A D C2M0045170P R 45 m DS(on) Silicon Carbide Power MOSFET TM C2M MOSFET Technology N-Channel Enhancement Mode Features Package TAB Optimized package with separate driver source pin Drain 8mm of creepage distance between drain and source High Blocking Voltage with Low On-Resistance High Speed Switching with Low Capacitances Easy to Parallel and Simple to Drive Halogen Free, RoHS Compliant Benefits Drain (Pin 1, TAB) Reduce switching losses and minimize gate ringing 1 2 3 4 Higher system efficiency D S S G Reduce cooling requirements Increase power density Increase system switching frequency Gate (Pin 4) Driver Power Applications Source Source (Pin 3) (Pin 2) 1500V Solar Inverters Switch Mode Power Supplies Part Number Package Marking High Voltage DC/DC converters Pulsed Power Applications C2M0045170P TO-247-4 Plus C2M0045170P Maximum Ratings (T = 25 C unless other wise specified) C Symbol Parameter Value Unit Test Conditions Note Drain - Source Voltage 1700 V V = 0 V, I = 100 A V GS D DSmax Gate - Source Voltage (dynamic) -10/+25 V AC (f >1 Hz) Note: 1 V GSmax Gate - Source Voltage (Static) -5/+20 V Static Note: 2 V GSop 72 Fig. 19 V =20 V, T = 25C GS C I Continuous Drain Current A D 48 V =20 V, T = 100C GS C I Pulsed Drain Current 160 A Fig. 22 Pulse width t limited by T D(pulse) jmax P P Power Dissipation 520 W T =25C, T = 150 C Fig. 20 C J D -40 to Operating Junction and Storage Temperature C T , T J stg +150 Solder Temperature 260 C 1.6mm (0.063) from case for 10s T L Note (1): When using MOSFE T Body Diode V = -5V/+25V GSmax Note (2): MOSFE T can also safely operate at 0/+20V 1 C2M0045170P Rev. -, 04-2018 Electrical Characteristics (T = 25C unless other wise specified) C Symbol Parameter Min. Typ. Max. Unit Test Conditions Note V (BR)DSS Drain-Source Breakdown Voltage 1700 V VGS = 0 V, ID = 100 A 2.0 2.6 4 V V = V , I = 18mA DS GS D V Gate Threshold Voltage Fig. 11 GS(th) 1.8 V V = V , I = 18mA, T = 150 C DS GS D J I Zero Gate Voltage Drain Current 2 100 A V = 1700 V, V = 0 V DSS DS GS IGSS Gate-Source Leakage Current 600 nA VGS = 20 V, VDS = 0 V 45 59 VGS = 20 V, ID = 50 A Fig. R Drain-Source On-State Resistance m DS(on) 4,5,6 90 V = 20 V, I = 50 A, T = 150 C GS D J 21.7 V = 20 V, I = 50 A DS DS g Transconductance S Fig. 7 fs 24.4 V = 20 V, I = 50 A, T = 150 C DS DS J Ciss Input Capacitance 3672 VGS = 0 V Fig. C Output Capacitance 171 oss pF VDS = 1000 V 17,18 C Reverse Transfer Capacitance 6.7 rss f = 1 MHz AC V = 25 mV E C Stored Energy 105 J Fig 16 oss oss V = 1200 V, V = -5/20 V, DS GS E Turn-On Switching Energy (SiC Diode FWD) 0.67 ON Fig. 26, mJ I = 50A, R = 2.5, L= 105 H, D G(ext) 29b E Turn Off Switching Energy (SiC Diode FWD) 0.31 OFF T = 150 C, using SiC Diode as FWD J V = 1200 V, V = -5/20 V, DS GS E Turn-On Switching Energy (Body Diode FWD) 2.8 ON Fig. 26, mJ I = 50A, R = 2.5, L= 105 H, D G(ext) 29a E Turn Off Switching Energy (Body Diode FWD) 0.35 OFF T = 150 C, using MOSFET as FWD J t Turn-On Delay Time 35 d(on) V = 1200 V, V = -5/20 V DD GS I = 50 A, D t Rise Time 13 r Fig. 27, ns R = 2.5 , Timing relative to V G(ext) DS 29 td(off ) Turn-Off Delay Time 46 Inductive load tf Fall Time 10 , R Internal Gate Resistance 1.3 f = 1 MHz V = 25 mV G(int) AC Q Gate to Source Charge 44 gs V = 1200 V, V = -5/20 V DS GS Q Gate to Drain Charge 57 nC I = 50 A Fig. 12 gd D Per IEC60747-8-4 pg 21 Qg Total Gate Charge 188 Reverse Diode Characteristics Symbol Parameter Typ. Max. Unit Test Conditions Note 4.1 V V = - 5 V, I = 25 A Fig. 8, 9, GS SD V Diode Forward Voltage 10 SD 3.6 V V = - 5 V, I = 25 A, T = 150 C Note 1 GS SD J I Continuous Diode Forward Current 72 A T = 25 C, V = - 5 V Note 1 S C GS t Reverse Recovery Time 44 ns rr V = - 5 V, I = 50 A , V = 1200 V GS SD R Q Reverse Recovery Charge 2 C Note 1 dif/dt = 3000 A/s rr I Peak Reverse Recovery Current 60 A rrm Note (1): When using SiC Body Diode the maximum recommended V = -5V GS Thermal Characteristics Symbol Parameter Typ. Max. Unit Test Conditions Note R Thermal Resistance from Junction to Case 0.22 0.24 Fig. 21 JC C/W R Thermal Resistance from Junction to Ambient 40 JC 2 C2M0045170P Rev. -, 04-2018

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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