BFU760F NPN wideband silicon germanium RF transistor Rev. 1 29 April 2011 Product data sheet 1. Product profile 1.1 General description NPN silicon germanium microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 1.2 Features and benefits Low noise high linearity RF transistor High maximum output third-order intercept point 32 dBm at 1.8 GHz 110 GHz f silicon germanium technology T 1.3 Applications Ka band oscillators DROs High linearity applications Medium output power applications Wi-Fi / WLAN / WiMAX GPS ZigBee SDARS first stage LNA LTE, cellular, UMTSBFU760F NXP Semiconductors NPN wideband silicon germanium RF transistor 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V collector-base voltage open emitter - - 10 V CBO V collector-emitter voltage open base - - 2.8 V CEO V emitter-base voltage open collector - - 1.0 V EBO I collector current - 25 70 mA C 1 P total power dissipation T 90 C - - 220 mW tot sp h DC current gain I =10mA V =2V 155 330 505 FE C CE T =25 C j C collector-base V =2V f=1MHz - 175 - fF CBS CB capacitance f transition frequency I =50mA V =1V -45 - GHz T C CE f= 2GHz T =25 C amb 2 G maximum power gain I =50mA V =1V -22 - dB p(max) C CE f= 2.4GHz T =25 C amb NF noise figure I =12mA V =2V -0.50 - dB C CE f= 2.4GHz = S opt IP3 third-order intercept I =30mA V =2.5 V -32 - dBm C CE point Z =Z =50 S L f= 2.4GHz T =25 C amb 1 T is the temperature at the solder point of the emitter lead. sp 2 G is the maximum power gain, if K > 1. If K < 1 then G = Maximum Stable Gain (MSG). p(max) p(max) 2. Pinning information Table 2. Discrete pinning Pin Description Simplified outline Graphic symbol 1emitter 34 4 2base 3emitter 2 4 collector 1, 3 2 1 mbb159 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BFU760F - plastic surface-mounted flat pack package reverse SOT343F pinning 4 leads BFU760F All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 29 April 2011 2 of 12