Product Information

NTTFS4800NTAG

NTTFS4800NTAG electronic component of ON Semiconductor

Datasheet
MOSFET NFET U8FL 30V 28A

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

697: USD 0.6035 ea
Line Total: USD 420.64

0 - Global Stock
MOQ: 697  Multiples: 697
Pack Size: 697
Availability Price Quantity
0 - Warehouse 1


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 1500
Multiples : 1

Stock Image

NTTFS4800NTAG
ON Semiconductor

1500 : USD 0.6669
1500 : USD 0.6493
1500 : USD 0.6318
1500 : USD 0.6084
4500 : USD 0.6084
9000 : USD 0.6084

0 - Warehouse 2


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 697
Multiples : 697

Stock Image

NTTFS4800NTAG
ON Semiconductor

697 : USD 0.6035

0 - Warehouse 3


Ships to you between Mon. 06 May to Fri. 10 May

MOQ : 1500
Multiples : 1500

Stock Image

NTTFS4800NTAG
ON Semiconductor

1500 : USD 0.1079

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Mounting Style
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NTTFS4800N Power MOSFET 30 V, 32 A, Single NChannel, 8FL Features Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses NTTFS4800N THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit Junction toCase (Drain) R 3.7 C/W JC JunctiontoAmbient Steady State (Note 3) R 56.7 JA JunctiontoAmbient Steady State (Note 4) R 146 JA JunctiontoAmbient (t 10 s) (Note 3) R 27.8 JA 3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 4. Surface mounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 16.2 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 24 V DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.5 3.0 V GS(TH) GS DS D Negative Threshold Temperature V /T 5.7 mV/C GS(TH) J Coefficient DraintoSource On Resistance R I = 20 A 11.1 20 m DS(on) D V = 10 V to 11.5 V GS I = 10 A 11 D I = 20 A 18 27 D V = 4.5 V GS I = 10 A 17 D Forward Transconductance g V = 1.5 V, I = 20 A 28 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 964 pF iss Output Capacitance C 225 V = 0 V, f = 1.0 MHz, V = 15 V oss GS DS Reverse Transfer Capacitance C 125 rss Total Gate Charge Q 8.4 nC G(TOT) Threshold Gate Charge Q 1.2 G(TH) V = 4.5 V, V = 15 V, I = 20 A GS DS D GatetoSource Charge Q 3.4 GS GatetoDrain Charge Q 3.8 GD Total Gate Charge Q V = 10 V, V = 15 V, I = 20 A 16.6 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 6) TurnOn Delay Time t 11.1 ns d(on) Rise Time t 21.8 r V = 4.5 V, V = 15 V, GS DS I = 15 A, R = 3.0 D G Turn Off Delay Time t 14 d(off) Fall Time t 3.4 f 5. Pulse Test: pulse width = 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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