NTF3055L108, NVF3055L108 MOSFET Power, N-Channel, Logic Level, SOT-223 www.onsemi.com 3.0 A, 60 V Designed for low voltage, high speed switching applications in power 3.0 A, 60 V supplies, converters and power motor controls and bridge circuits. R = 120 m DS(on) Features NChannel NVF Prefix for Automotive and Other Applications Requiring D Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable These Devices are PbFree and are RoHS Compliant G Applications Power Supplies S Converters Power Motor Controls Bridge Circuits 4 SOT223 MAXIMUM RATINGS (T = 25C unless otherwise noted) C CASE 318E 1 STYLE 3 Rating Symbol Value Unit 2 3 DraintoSource Voltage V 60 Vdc DSS MARKING DIAGRAM DraintoGate Voltage (R = 1.0 M ) V 60 Vdc GS DGR GatetoSource Voltage Continuous V 15 Vdc GS AYW 3055L = Device Code Nonrepetitive (t 10 ms) 20 Vpk p 3055L A = Assembly Location Drain Current Adc Y = Year Continuous T = 25C (Note 1) I 3.0 W = Work Week A D Continuous T = 100C (Note 2) I 1.4 Apk D = PbFree Package A Single Pulse (t 10 s) I 9.0 DM (Note: Microdot may be in either location) p Total Power Dissipation T = 25C (Note 1) P 2.1 Watts A D Total Power Dissipation T = 25C (Note 2) 1.3 Watts A PIN ASSIGNMENT Derate above 25C 0.014 W/C 4 Drain Operating and Storage Temperature Range T , T 55 C J stg to 175 Single Pulse DraintoSource Avalanche E 74 mJ AS Energy Starting T = 25C J (V = 25 Vdc, V = 5.0 Vdc, DD GS I = 7.0 Apk, L = 3.0 mH, V = 60 Vdc) L(pk) DS 1 2 3 Thermal Resistance C/W Gate Drain Source JunctiontoAmbient (Note 1) R 72.3 JA JunctiontoAmbient (Note 2) 114 R JA Maximum Lead Temperature for Soldering T 260 C ORDERING INFORMATION L Purposes, 1/8 from case for 10 seconds See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2019 Rev. 9 NTF3055L108/DNTF3055L108, NVF3055L108 1. When surface mounted to an FR4 board using 1 pad size, 1 oz. 2 (Cu. Area 1 in ). 2. When surface mounted to an FR4 board using minimum recommended pad 2 size, 2 oz. (Cu. Area 0.272 in ). www.onsemi.com 2