Product Information

BSM080D12P2C008

BSM080D12P2C008 electronic component of ROHM

Datasheet
Discrete Semiconductor Modules Half Bridge Module SiC DMOS & SBD 1200V

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 261.17 ea
Line Total: USD 261.17

10 - Global Stock
Ships to you between
Mon. 20 May to Fri. 24 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
12 - WHS 1


Ships to you between Fri. 24 May to Tue. 28 May

MOQ : 1
Multiples : 1
1 : USD 381.2135
12 : USD 379.086

1 - WHS 2


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 571.318

10 - WHS 3


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 261.17

11 - WHS 4


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 548.9492
2 : USD 535.4728
3 : USD 524.7635

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Vgs - Gate-Source Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Configuration
Operating Temperature Range
Brand
Number Of Channels
Id - Continuous Drain Current
Pd - Power Dissipation
Factory Pack Quantity :
Vds - Drain-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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10 9 8 7 6 5 SiC Power Module BSM080D12P2C008 Datasheet Application Circuit diagram Motor drive 1 Inverter, Converter 10 Photovoltaics, wind power generation. 9 8(N.C) 3,4 Induction heating equipment. 5 6 7(N.C) Features 2 *Do not connnect to NC pin. 1) Low surge, low switching loss. 2) High-speed switching possible. 3) Reduced temperature dependence. Construction This product is a half bridge module consisting of SiC-DMOS and SiC SBD from ROHM. Dimensions & Pin layout (Unit : mm) 4 1 2 3 (M2.6 FOR SELF- TAPPING www.rohm.com 2019 ROHM Co., Ltd. All rights reserved. 8.Jul.2019 - Rev.001 1/10Datasheet BSM080D12P2C008 Absolute maximum ratings (Tj = 25C) Parameter Symbol Conditions Limit Unit Drain-source voltage V 1200 G-S short DSS Gate-source voltage( ) 22 V D-S short V GSS Gate-source voltage( ) 6 G - S voltage (t <300ns) V D-S short 10 to 26 surge GSSsurge I DC(T =60C) 80 D c 1 Drain current * 2 I 160 Pulse (T =60C) 1ms* DRM c A I DC(T = 60C) V =18V 80 S c GS 1 Source current * I 160 Pulse (T =60C) 1ms V =18V SRM c GS 3 Ptot T =25C 600 W Total power disspation * c Max junction temperature T 175 jmax Junction temperature T C 40 to150 jop T Storage temperature 40 to125 stg Terminals to baseplate, Isolation voltage Visol 2500 Vrms f=60Hz AC 1min. Main Terminals : M6 screw 4.5 Mounting torque N m Mounting to heat shink : M5 screw 3.5 (*1) Case temperature (T ) is defined on the surface of base plate just under the chips. c (*2) Repetition rate should be kept within the range where temperature rise if die should not exceed T jmax. (*3) T is less than 175C j Example of acceptable VGS waveform 26V t surge 22V 0V t surge 6V 10V www.rohm.com 2019 ROHM Co., Ltd. All rights reserved. 8.Jul.2019 - Rev.001 2/10

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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