Product Information

NTD4809NHT4G

NTD4809NHT4G electronic component of ON Semiconductor

Datasheet
MOSFET NFET DPAK 30V 58A 9MOHM

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1457: USD 0.2887 ea
Line Total: USD 420.64

0 - Global Stock
MOQ: 1457  Multiples: 1457
Pack Size: 1457
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 2500
Multiples : 1

Stock Image

NTD4809NHT4G
ON Semiconductor

2500 : USD 0.2317
5000 : USD 0.2291

0 - WHS 2


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 1457
Multiples : 1457

Stock Image

NTD4809NHT4G
ON Semiconductor

1457 : USD 0.2887

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Channel Mode
Configuration
Series
Brand
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
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NTD4809NH, NVD4809NH Power MOSFET 30 V, 58 A, Single NChannel, DPAK/IPAK Features Low R to Minimize Conduction Losses DS(on) Low Capacitance to Minimize Driver Losses NTD4809NH, NVD4809NH THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit Junction toCase (Drain) R 2.9 C/W JC Junction toTAB (Drain) R 3.5 JC TAB JunctiontoAmbient Steady State (Note 1) R 74  JA JunctiontoAmbient Steady State (Note 2) R 116 JA 1. Surfacemounted on FR4 board using 1 in sq pad size, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 25 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 24 V DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 250 A 1.5 2.1 2.5 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 5.7 mV/C GS(TH) J DraintoSource On Resistance R V = 10 to I = 30 A 7.0 9.0 m DS(on) GS D 11.5 V I = 15 A 7.0 D V = 4.5 V I = 30 A 10.45 12.5 GS D I = 15 A 9.95 D Forward Transconductance g V = 15 V, I = 15 A 9.0 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 1596 2155 pF iss V = 0 V, f = 1.0 MHz, GS Output Capacitance C 331 447 oss V = 12 V DS Reverse Transfer Capacitance C 190 294 rss nC Total Gate Charge Q 12.5 15 G(TOT) Threshold Gate Charge Q 2.4 3.6 G(TH) V = 4.5 V, V = 15 V, GS DS I = 30 A D GatetoSource Charge Q 5.3 7.9 GS GatetoDrain Charge Q 5.1 7.7 GD Total Gate Charge Q V = 11.5 V, V = 15 V, 29.3 44 nC G(TOT) GS DS I = 30 A D SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 12.0 18 ns d(on) Rise Time t 20 30 r V = 4.5 V, V = 15 V, GS DS I = 15 A, R = 3.0  D G Turn Off Delay Time t 14 21 d(off) Fall Time t 5.0 7.5 f TurnOn Delay Time t 7.0 10.4 ns d(on) Rise Time t 18 27 r V = 11.5 V, V = 15 V, GS DS I = 15 A, R = 3.0  D G Turn Off Delay Time t 22 33 d(off) Fall Time t 3.0 4.6 f 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 4. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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